It is still a challenge to fabricate a smooth, high-quality perovskite film under ambient conditions via an inkjet printing process. Here, we report a systematic study of the fabrication of one-step inkjet-printed metal halide perovskite (IJP-MHP) films under ambient conditions. An inkjet-printed perovskite film with full surface coverage and large columnar grains was obtained through in situ heat treatment, self-vapor annealing (self-VA), and solvent engineering. An efficiency of 13.44% was achieved for the perovskite solar cell (PSC) with an architecture of FTO/IJP-SnO x /IJP-MHP/IJP-spiro-OMeTAD/Au. Furthermore, an ink additive polyvinylpyrrolidone (PVP) and antisolvent extraction treatment were carried out to retard perovskite nucleation and grain growth. Resulting perovskite films with improved film morphology and uniformity were obtained, although they delivered no competitive performance. Further optimization can be conducted to improve efficiency by careful selection of ink additives.

The primary challenge for the commercialization of hybrid perovskite solar cells (PSCs) is their chemical and thermal instability as compared to Si devices. Herein, we demonstrate that PSCs spray-coated with polystyrene retain 80% of their efficiency after 40 hours immersed in water or at 95 degrees C.

The pursuit of p-type semiconductors has garnered considerable attention in academia and industry. Among the potential candidates, copper iodide (CuI) stands out as a highly promising p-type material due to its conductivity, cost-effectiveness, and low environmental impact. CuI can be employed to create thin films with >80% transparency within the visible range (400–750 nm) and utilizing various low-temperature, scalable deposition techniques. This review summarizes the deposition techniques for CuI as a hole-transport material and their performance in perovskite solar cells, thin-film transistors, and light-emitting diodes using diverse processing methods. The preparation methods of making thin films are divided into two categories: wet and neat methods. The advancements in CuI as a hole-transporting material and interface engineering techniques hold promising implications for the continued development of such devices.

The current paper describes the formation of a new series of platinum(II) complexes with 5,7-di-tert-butyl-2-(thiophen-2-yl)benzo[d]oxazole (btbo) ligand. This study has focused on synthesis methods of some organoplatinum(II) complexes containing btbo ligand from two different reagents under different conditions. Furthermore, a detailed computational study was performed to identify the thermodynamic parameter's behavior. The synthesis was initiated from some complexes including cis-[PtCl2(dmso)(2)], R1, [PtCl2(COD)], R2 and a benzoxazole derivative as organic ligand 5,7-di-tert-butyl-2-(thiophen-2-yl)benzo[d]oxazole, (btbo). Implementation of the H-1 NMR analysis procedure on products reveals two isomers' existence. Moreover, the thermodynamic parameters, (Delta H degrees, Delta G degrees, Delta S degrees), were quantified to achieve a more precise understanding. The energy diagram examination and considering the quantified parameters present the stability and instability of each product which is in notable agreement with the experimental data.