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Gatty, H. K., Stemme, G. & Roxhed, N. (2018). A Miniaturized Amperometric Hydrogen Sulfide Sensor Applicable for Bad Breath Monitoring. Micromachines, 9(12), Article ID 612.
Open this publication in new window or tab >>A Miniaturized Amperometric Hydrogen Sulfide Sensor Applicable for Bad Breath Monitoring
2018 (English)In: Micromachines, ISSN 2072-666X, E-ISSN 2072-666X, Vol. 9, no 12, article id 612Article in journal (Refereed) Published
Abstract [en]

Bad breath or halitosis affects a majority of the population from time to time, causing personal discomfort and social embarrassment. Here, we report on a miniaturized, microelectromechanical systems (MEMS)-based, amperometric hydrogen sulfide (H2S) sensor that potentially allows bad breath quantification through a small handheld device. The sensor is designed to detect H2S gas in the order of parts-per-billion (ppb) and has a measured sensitivity of 0.65 nA/ppb with a response time of 21 s. The sensor was found to be selective to NO and NH3 gases, which are normally present in the oral breath of adults. The ppb-level detection capability of the integrated sensor, combined with its relatively fast response and high sensitivity to H2S, makes the sensor potentially applicable for oral breath monitoring.

Place, publisher, year, edition, pages
MDPI, 2018
Keywords
hydrogen sulfide, amperometric, MEMS, gas sensor, bad breath, halitosis
National Category
Medical Laboratory and Measurements Technologies
Identifiers
urn:nbn:se:kth:diva-242263 (URN)10.3390/mi9120612 (DOI)000455072800003 ()30469481 (PubMedID)2-s2.0-85057839920 (Scopus ID)
Note

QC 20190204

Available from: 2019-02-04 Created: 2019-02-04 Last updated: 2019-02-04Bibliographically approved
Ribet, F., De Pietro, L., Roxhed, N. & Stemme, G. (2018). Gas diffusion and evaporation control using EWOD actuation of ionic liquid microdroplets for gas sensing applications. Sensors and actuators. B, Chemical, 267, 647-654
Open this publication in new window or tab >>Gas diffusion and evaporation control using EWOD actuation of ionic liquid microdroplets for gas sensing applications
2018 (English)In: Sensors and actuators. B, Chemical, ISSN 0925-4005, E-ISSN 1873-3077, Vol. 267, p. 647-654Article in journal (Refereed) Published
Abstract [en]

The lifetime of electrochemical gas sensors suffers from electrolyte evaporation and from the impracticality to perform recalibration. To tackle these issues, a prototype of a microfabricated gas diffusion controlling system, based on coplanar electrowetting-on-dielectric (EWOD) actuation of ionic liquid microdroplets, is presented. The system is designed to be integrated with electrochemical gas sensors to allow on-demand sealing of the sensing chamber from the environment. The MEMS device can be electrically toggled between an open and a closed state, in which the microdroplets are used to cover or uncover the openings of a perforated membrane connecting to the sensing compartment, respectively. This ON/OFF diffusion-blocking valve mechanism potentially allows for recalibration and for liquid electrolyte evaporation reduction when the sensor is not in use, thus extending the gas sensor lifetime. A one order of magnitude reduction of evaporation rate and a more than three orders of magnitude reduction of gas diffusion time were experimentally demonstrated. Ionic liquid movement can be performed with an applied AC voltage as low as 18 V, using super-hydrophobic cover plates to facilitate droplet motion. Furthermore, the shown ionic liquid micro-droplet manipulation provides a robust and low voltage platform for digital microfluidics, readily adaptable to serve different applications.

Place, publisher, year, edition, pages
Elsevier, 2018
Keywords
Contact angle modulation, Electrochemical gas sensing, Electrowetting on dielectric, Gas diffusion valve, Ionic liquids, MEMS actuator
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-229250 (URN)10.1016/j.snb.2018.04.076 (DOI)000432775600076 ()2-s2.0-85046339371 (Scopus ID)
Funder
EU, European Research Council, 267528Swedish Research Council
Note

QC 20180601

Available from: 2018-06-01 Created: 2018-06-01 Last updated: 2018-08-20Bibliographically approved
Hauser, J., Lenk, G., Hansson, J., Beck, O., Stemme, G. & Roxhed, N. (2018). High-Yield Passive Plasma Filtration from Human Finger Prick Blood. Analytical Chemistry, 90(22), 13393-13399
Open this publication in new window or tab >>High-Yield Passive Plasma Filtration from Human Finger Prick Blood
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2018 (English)In: Analytical Chemistry, ISSN 0003-2700, E-ISSN 1520-6882, Vol. 90, no 22, p. 13393-13399Article in journal (Refereed) Published
Abstract [en]

Whole-blood microsampling provides many benefits such as remote, patient-centric, and minimally invasive sampling. However, blood plasma, and not whole blood, is the prevailing matrix in clinical laboratory investigations. The challenge with plasma microsampling is to extract plasma volumes large enough to reliably detect low-concentration analytes from a small finger prick sample. Here we introduce a passive plasma filtration device that provides a high extraction yield of 65%, filtering 18 mu L of plasma from 50 mu L of undiluted human whole blood (hematocrit 45%) within less than 10 min. The enabling design element is a wedge-shaped connection between the blood filter and the hydrophilic bottom surface of a capillary channel. Using finger prick and venous blood samples from more than 10 healthy volunteers, we examined the filtration kinetics of the device over a hematocrit range of 35-55% and showed that 73 +/- 8% of the total protein content was successfully recovered after filtration. The presented plasma filtration device tackles a major challenge toward patient-centric blood microsampling by providing high-yield plasma filtration, potentially allowing reliable detection of low-concentration analytes from a blood microsample.

Place, publisher, year, edition, pages
AMER CHEMICAL SOC, 2018
National Category
Chemical Sciences
Identifiers
urn:nbn:se:kth:diva-239997 (URN)10.1021/acs.analchem.8b03175 (DOI)000451246100037 ()30379058 (PubMedID)2-s2.0-85056544539 (Scopus ID)
Note

QC 20181211

Available from: 2018-12-11 Created: 2018-12-11 Last updated: 2018-12-11Bibliographically approved
Ribet, F., De Pietro, L., Roxhed, N. & Stemme, G. (2018). Ionic liquid microdroplet manipulation by electrowetting-on-dielectric for on/off diffusion control. In: 2018 IEEE Micro Electro Mechanical Systems (MEMS): . Paper presented at 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, Belfast, United Kingdom, 21 January 2018 through 25 January 2018 (pp. 1181-1184). Institute of Electrical and Electronics Engineers (IEEE)
Open this publication in new window or tab >>Ionic liquid microdroplet manipulation by electrowetting-on-dielectric for on/off diffusion control
2018 (English)In: 2018 IEEE Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1181-1184Conference paper, Published paper (Refereed)
Abstract [en]

This article presents a proof-of-concept of a device able to control (ON/OFF) gas diffusion through a perforated membrane. The microfabricated system is based on electrowetting-on-dielectric (EWOD) actuation of ionic liquid (IL) microdroplets and can be electrically toggled from an open to a closed state, in which microdroplets cover or uncover the membrane openings, respectively. The system is designed to be integrated with liquid-electrolyte-based electrochemical gas sensors, to extend their lifetime by reducing electrolyte evaporation and allowing recalibration. The realized device was proven to limit gas diffusion and water evaporation through perforated portions of thin membranes on command.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018
Series
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), ISSN 1084-6999
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-228548 (URN)10.1109/MEMSYS.2018.8346773 (DOI)000434960900308 ()2-s2.0-85047004600 (Scopus ID)9781538647820 (ISBN)
Conference
31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, Belfast, United Kingdom, 21 January 2018 through 25 January 2018
Funder
EU, European Research CouncilSwedish Research Council
Note

QC 20180528

Available from: 2018-05-28 Created: 2018-05-28 Last updated: 2018-09-05Bibliographically approved
Dubois, V. J., Raja, S. N., Gehring, P., Caneva, S., van der Zant, H. S. J., Niklaus, F. & Stemme, G. (2018). Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices. Nature Communications, 9, Article ID 3433.
Open this publication in new window or tab >>Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
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2018 (English)In: Nature Communications, ISSN 2041-1723, E-ISSN 2041-1723, Vol. 9, article id 3433Article in journal (Refereed) Published
Abstract [en]

Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm(2), with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.

Place, publisher, year, edition, pages
Nature Publishing Group, 2018
National Category
Condensed Matter Physics
Identifiers
urn:nbn:se:kth:diva-234594 (URN)10.1038/s41467-018-05785-2 (DOI)000442594800035 ()30143636 (PubMedID)2-s2.0-85052211020 (Scopus ID)
Note

QC 20180914

Available from: 2018-09-14 Created: 2018-09-14 Last updated: 2018-09-14Bibliographically approved
Ribet, F., Stemme, G. & Roxhed, N. (2018). Microneedle-based system for minimally invasive continuous monitoring of glucose in the dermal interstitial fluid. In: 2018 IEEE Micro Electro Mechanical Systems (MEMS): . Paper presented at 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, Belfast, United Kingdom, 21 January 2018 through 25 January 2018 (pp. 408-411). Institute of Electrical and Electronics Engineers (IEEE), 2018
Open this publication in new window or tab >>Microneedle-based system for minimally invasive continuous monitoring of glucose in the dermal interstitial fluid
2018 (English)In: 2018 IEEE Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers (IEEE), 2018, Vol. 2018, p. 408-411Conference paper, Published paper (Refereed)
Abstract [en]

We present a minimally invasive continuous glucose monitoring (CGM) device. The system consists in an ultra-miniaturized electrochemical sensor probe (70 × 700 × 50 μm3) inserted into the lumen of a hollow silicon microneedle. The implantable portion of the system is 50-fold smaller than state-of-the-art commercial products, thus enabling glucose monitoring in the dermis and a less invasive insertion procedure. Passive interstitial fluid extraction is achieved, making the daily use of this system practically viable. Moreover, the sensor positioning provides minimal delay in tracking glycaemia (5-10 minutes lag), due to the minimal distance between sensing electrodes and microneedle opening. The demonstrated system has therefore the potential to enable minimally invasive, fast and reliable CGM in patients affected by diabetes.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018
Series
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), ISSN 1084-6999
National Category
Embedded Systems
Identifiers
urn:nbn:se:kth:diva-228550 (URN)10.1109/MEMSYS.2018.8346574 (DOI)000434960900109 ()2-s2.0-85046998695 (Scopus ID)9781538647820 (ISBN)
Conference
31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, Belfast, United Kingdom, 21 January 2018 through 25 January 2018
Funder
VINNOVA, E!8573EU, European Research Council, 267528
Note

QC 20180528

Available from: 2018-05-28 Created: 2018-05-28 Last updated: 2018-09-03Bibliographically approved
Errando-Herranz, C., Edinger, P., Colangelo, M., Björk, J., Ahmed, S., Stemme, G., . . . Gylfason, K. B. (2018). New dynamic silicon photonic components enabled by MEMS technology. In: Proceedings Volume 10537, Silicon Photonics XIII: . Paper presented at Silicon Photonics XIII 2018, San Francisco, United States, 29 January 2018 through 1 February 2018. SPIE - International Society for Optical Engineering, 10537, Article ID 1053711.
Open this publication in new window or tab >>New dynamic silicon photonic components enabled by MEMS technology
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2018 (English)In: Proceedings Volume 10537, Silicon Photonics XIII, SPIE - International Society for Optical Engineering, 2018, Vol. 10537, article id 1053711Conference paper, Published paper (Refereed)
Abstract [en]

Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

Place, publisher, year, edition, pages
SPIE - International Society for Optical Engineering, 2018
Series
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X ; 10537
Keywords
MEMS, silicon photonics, tuning, ring resonator, waveguide dispersion, surface grating coupler
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-225106 (URN)10.1117/12.2297588 (DOI)000448020000015 ()2-s2.0-85047395610 (Scopus ID)9781510615595 (ISBN)
Conference
Silicon Photonics XIII 2018, San Francisco, United States, 29 January 2018 through 1 February 2018
Projects
VR-HETXMEMSM&M
Funder
Swedish Research Council, 621-2012-5364Swedish Research Council, B0460801EU, European Research Council, 277879EU, European Research Council, 267528
Note

QC 20180404

Available from: 2018-03-28 Created: 2018-03-28 Last updated: 2018-11-12Bibliographically approved
Dubois, V. J., Bleiker, S. J., Stemme, G. & Niklaus, F. (2018). Scalable Manufacturing of Nanogaps. Advanced Materials, 30(46), Article ID 1801124.
Open this publication in new window or tab >>Scalable Manufacturing of Nanogaps
2018 (English)In: Advanced Materials, ISSN 0935-9648, E-ISSN 1521-4095, Vol. 30, no 46, article id 1801124Article, review/survey (Refereed) Published
Abstract [en]

The ability to manufacture a nanogap in between two electrodes has proven a powerful catalyst for scientific discoveries in nanoscience and molecular electronics. A wide range of bottom-up and top-down methodologies are now available to fabricate nanogaps that are less than 10 nm wide. However, most available techniques involve time-consuming serial processes that are not compatible with large-scale manufacturing of nanogap devices. The scalable manufacturing of sub-10 nm gaps remains a great technological challenge that currently hinders both experimental nanoscience and the prospects for commercial exploitation of nanogap devices. Here, available nanogap fabrication methodologies are reviewed and a detailed comparison of their merits is provided, with special focus on large-scale and reproducible manufacturing of nanogaps. The most promising approaches that could achieve a breakthrough in research and commercial applications are identified. Emerging scalable nanogap manufacturing methodologies will ultimately enable applications with high scientific and societal impact, including high-speed whole genome sequencing, electromechanical computing, and molecular electronics using nanogap electrodes.

Place, publisher, year, edition, pages
Wiley-VCH Verlagsgesellschaft, 2018
Keywords
break junctions, crack junctions, nanogap electrodes, parallel fabrication, wafer scale
National Category
Other Engineering and Technologies not elsewhere specified
Identifiers
urn:nbn:se:kth:diva-240766 (URN)10.1002/adma.201801124 (DOI)000453355300001 ()30156331 (PubMedID)2-s2.0-85052216514 (Scopus ID)
Note

QC 20190107

Available from: 2019-01-07 Created: 2019-01-07 Last updated: 2019-01-07Bibliographically approved
Laakso, M. J., Bleiker, S. J., Liljeholm, J., Mårtensson, G. E., Asiatici, M., Fischer, A. C., . . . Niklaus, F. (2018). Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. IEEE Access, 6, 44306-44317
Open this publication in new window or tab >>Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
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2018 (English)In: IEEE Access, E-ISSN 2169-3536, Vol. 6, p. 44306-44317Article in journal (Refereed) Published
Abstract [en]

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018
Keywords
Chip scale packaging, femtosecond laser, glass interposer, laser ablation, multichip modules, robotic assembly, self-assembly, spin-on glass, thermal expansion, through-glass via, through-silicon vias, TSV
National Category
Communication Systems
Identifiers
urn:nbn:se:kth:diva-235465 (URN)10.1109/ACCESS.2018.2861886 (DOI)000444505800001 ()2-s2.0-85050982480 (Scopus ID)
Funder
Knut and Alice Wallenberg FoundationVINNOVA, 324189Swedish Foundation for Strategic Research , GMT14-0071 RIF14-0017
Note

QC 20180928

Available from: 2018-09-28 Created: 2018-09-28 Last updated: 2018-10-02Bibliographically approved
Laakso, M., Bleiker, S. J., Liljeholm, J., Mårtensson, G., Asiatici, M., Fischer, A. C., . . . Niklaus, F. (2018). Through-Glass Vias for MEMS Packaging. In: : . Paper presented at The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May.
Open this publication in new window or tab >>Through-Glass Vias for MEMS Packaging
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2018 (English)Conference paper, Oral presentation with published abstract (Other academic)
Abstract [en]

Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs). The method allows rapid filling of via holes with metal rods both in thin and thick glass substrates.

Background Vertical electrical feedthroughs in glass substrates, i.e. TGVs, are often required in wafer-scale packaging of MEMS that utilizes glass lids. The current methods of making TGVs have drawbacks that prevent the full utilization of the excellent properties of glass as a package material, e.g. low RF losses. Magnetic assembly has been used earlier to fabricate through-silicon vias (TSVs), and in this work we extend this method to realize TGVs [1].

Methods The entire TGV fabrication process is maskless, and the processes used include: direct patterning of wafer metallization using femtosecond laser ablation, magnetic-fieldassisted self-assembly of metal wires into via holes, and solder-paste jetting of bump bonds on TGVs.

Results We demonstrate that: (1) the magnetically assembled TGVs have a low resistance, which makes them suitable even for low-loss and high-current applications; (2) the magneticassembly process can be parallelized in order to increase the wafer-scale fabrication speed; (3) the magnetic assembly produces void-free metal filling for TGVs, which allows solder placement directly on top of the TGV for the purpose of high integration density; and (4) good thermal-expansion compatibility between TGV metals and glass substrates is possible with the right choice of materials, and several suitable metals-glass pairs are identified for possible improvement of package reliability [2].

[1] M. Laakso et al., IEEE 30th Int. Conf. on MEMS, 2017. DOI:10.1109/MEMSYS.2017.7863517

[2] M. Laakso et al., “Through-Glass Vias for Glass Interposers and MEMS Packaging Utilizing Magnetic Assembly of Microscale Metal Wires,” manuscript in preparatio

National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-238647 (URN)
Conference
The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May
Note

QC 20181106

Available from: 2018-11-06 Created: 2018-11-06 Last updated: 2018-11-06Bibliographically approved
Organisations
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0001-9552-4234

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