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Publications (10 of 235) Show all publications
Velander, E., Kruse, L. (., Wiik, T. (., Wiberg, A., Colmenares, J. & Nee, H.-P. (2018). An IGBT Turn-ON Concept Offering Low Losses Under Motor Drive dv/dt Constraints Based on Diode Current Adaption. IEEE transactions on power electronics, 33(2), 1143-1153
Open this publication in new window or tab >>An IGBT Turn-ON Concept Offering Low Losses Under Motor Drive dv/dt Constraints Based on Diode Current Adaption
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2018 (English)In: IEEE transactions on power electronics, ISSN 0885-8993, E-ISSN 1941-0107, Vol. 33, no 2, p. 1143-1153Article in journal (Refereed) Published
Abstract [en]

In this paper, a new low-loss turn-ON concept for the silicon insulated-gate bipolar transistor (Si-IGBT) in combination with silicon p-i-n diode is presented. The concept is tailored for two-level motor converters in the 100 kW to 1 MW range under the constraint that the output voltages slopes are limited in order to protect the motor windings. Moreover, analyses of the IGBT turn-ON and diode reverse recovery voltage slopes are presented concluding that the diode reverse recovery is the worst case. The concept includes a low-cost measurement of the free-wheeling diode current and temperature by the gate driver without necessity of acquiring this information from the converter control board. By using this concept, the output dv/dt at the diode turn-OFF can be kept approximately constant regardless of the commutated current and junction temperature. Hence, the switching losses could be decreased for the currents and temperatures where the voltage slopes are lower when using a conventional gate driver optimized for the worst case. Moreover, results are shown for one such power semiconductor, showing a total switching loss reduction of up to 28% in comparison with a gate driver without current and temperature measurement. Finally, this concept is particularly suitable for high power semiconductor modules in half-bridge configuration which are recently proposed by several suppliers.

Place, publisher, year, edition, pages
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2018
Keyword
motor drives, insulated gate bipolar transistors, power semiconductor devices
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-217925 (URN)10.1109/TPEL.2017.2688474 (DOI)000414414600025 ()2-s2.0-85034081872 (Scopus ID)
Note

QC 20171121

Available from: 2017-11-21 Created: 2017-11-21 Last updated: 2017-11-21Bibliographically approved
Velander, E., Bohlin, G., Sandberg, A., Wiik, T., Botling, F., Lindahl, M., . . . Nee, H.-P. (2018). An Ultralow Loss Inductorless dv/dt Filter Concept for Medium-Power Voltage Source Motor Drive Converters With SiC Devices. IEEE transactions on power electronics, 33(7), 6072-6081
Open this publication in new window or tab >>An Ultralow Loss Inductorless dv/dt Filter Concept for Medium-Power Voltage Source Motor Drive Converters With SiC Devices
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2018 (English)In: IEEE transactions on power electronics, ISSN 0885-8993, E-ISSN 1941-0107, Vol. 33, no 7, p. 6072-6081Article in journal (Refereed) Published
Abstract [en]

In this paper, a novel dv/dt filter is presented targeted for 100-kW to 1-MW voltage source converters using silicon carbide (SiC) power devices. This concept uses the stray inductance between the power device and the converter output as a filter component in combination with an additional small RC-link. Hence, a lossy, bulky, and costly filter inductor is avoided and the resulting output dv/dt is limited to 5-10 kV/mu s independent of the output current and switching speed of the SiC devices. As a consequence, loads with dv/dt constraints, e.g., motor drives can be fed from SiC devices enabling full utilization of their high switching speed. Moreover, a filter-model is proposed for the selection of filter component values for a certain dv/dt requirement. Finally, results are shown using a 300-A 1700-V SiC metal-oxide-semiconductor field-effect transistor (MOSFET). These results show that the converter output dv/dt can be limited to 7.5 kV/mu s even though values up to 47 kV/mu s weremeasured across the SiC MOSFET module. Hence, the total switching losses, including the filter losses, are verified to be three times lower compared to when the MOSFET dv/dt was slowed down by adjusting the gate driver.

Place, publisher, year, edition, pages
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2018
Keyword
AC motor drives, dv/dt control methods, electromagnetic interference (EMI), filters, power semiconductor devices, SiC MOSFET
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-226180 (URN)10.1109/TPEL.2017.2739839 (DOI)000428645100047 ()2-s2.0-85028466153 (Scopus ID)
Note

QC 20180516

Available from: 2018-05-16 Created: 2018-05-16 Last updated: 2018-05-16Bibliographically approved
Risseh, A., Nee, H.-P. & Goupil, C. (2018). Electrical Power Conditioning System for Thermoelectric Waste Heat Recovery in Commercial Vehicles. IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (99)
Open this publication in new window or tab >>Electrical Power Conditioning System for Thermoelectric Waste Heat Recovery in Commercial Vehicles
2018 (English)In: IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION, ISSN 2332-7782, no 99Article in journal (Refereed) Published
Abstract [en]

A considerable part of the fuel energy in vehicles never reaches the wheels and entirely converts to waste heat. In a heavy duty vehicle (HDV) the heat power that escapes from the exhaust system may reach 170 kW. The waste heat can be converted into useful electrical power using thermoelectric generator (TEG). During the last decades, many studies on the electrical power conditioning system of TEGs have been conducted. However, there is a lack of studies evaluating the electrical instrumentation, the impact of the converter-efficiency, and the TEG arrangement on a real large-scale TEG on-boarda drivable vehicle. In this study, the most important parameters for designing electrical power conditioning systems for two TEGs, developed for a real-scale HDV as well as experimental results demonstrating the recovered electrical power, are presented. Eight synchronous inter-leaved step-down converters with 98 % efficiency with perturb and observe maximum power point tracker was developed and tested for this purpose. The power conditioning system was communicating with the on-board computers through the controller area network and reported the status of the TEGs and the recovered electrical power. The maximum recovered electrical power from the TEGs reached 1 kW which was transmitted to the electrical system of the vehicle, relieving the internal combustion engine.

Place, publisher, year, edition, pages
IEEE, 2018
Keyword
Thermoelectricity, power converter, power management, silicon carbide MOSFET, maximum power point tracker, inter-leaved converter, internal combustion engine, energy harvesting, heavy duty vehicle, thermoelectric generator, renewable energy sources, exhaust system
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-222266 (URN)10.1109/TTE.2018.2796031 (DOI)
Note

QC 20180206

Available from: 2018-02-05 Created: 2018-02-05 Last updated: 2018-03-13Bibliographically approved
Krismer, F., Schroth, S., Ertl, H., Kostov, K. S., Nee, H.-P. & Kolar, J. W. (2017). Analysis and Practical Relevance of CM/DM EMI Noise Separator Characteristics. IEEE transactions on power electronics, 32(4), 3112-3127
Open this publication in new window or tab >>Analysis and Practical Relevance of CM/DM EMI Noise Separator Characteristics
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2017 (English)In: IEEE transactions on power electronics, ISSN 0885-8993, E-ISSN 1941-0107, Vol. 32, no 4, p. 3112-3127Article in journal (Refereed) Published
Abstract [en]

This work investigates sources of measurement errors that result for common mode/differential mode (CM/DM) separators in a practical measurement environment, with a particular focus on the recently presented input impedance criterion for CM/DM separators, derives the respective analytical expressions, and employs a detailed analytical model to verify the obtained findings. Furthermore, a method is derived, which determines the worst-case measurement error by reason of cross coupling for given measured DM and CM output voltage components. Based on an example, this work illustrates how the obtained expressions can be advantageously used in a computer program to automatically decide whether a particular spectral measurement component represents a useful measurement result or if it is strongly affected by cross coupling (CM to DM and DM to CM). Finally, the paper presents the realization and accompanying experimental results of an active CM/DM separator, which allows for low realization effort and features competitive separation capabilities (DMTR/CMRR > 50 dB and CMTR/DMRR > 42 dB for frequencies up to 10 MHz).

Place, publisher, year, edition, pages
IEEE Press, 2017
Keyword
Analog processing circuits, electromagnetic compatibility, electromagnetic interference (EMI), frequency domain analysis, measurement errors, power electronics, voltage measurement
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-204051 (URN)10.1109/TPEL.2016.2579267 (DOI)000395480400055 ()2-s2.0-85011060890 (Scopus ID)
Note

QC 20170330

Available from: 2017-03-30 Created: 2017-03-30 Last updated: 2017-11-29Bibliographically approved
Nikouie Harnefors, M., Wallmark, O., Jin, L., Harnefors, L. & Nee, H.-P. (2017). DC-link stability analysis and controller design for the stacked polyphase bridges converter. IEEE transactions on power electronics, 32(2), 1666-1674, Article ID 7451258.
Open this publication in new window or tab >>DC-link stability analysis and controller design for the stacked polyphase bridges converter
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2017 (English)In: IEEE transactions on power electronics, ISSN 0885-8993, E-ISSN 1941-0107, Vol. 32, no 2, p. 1666-1674, article id 7451258Article in journal (Refereed) Published
Abstract [en]

The stacked polyphase bridges (SPB) converter consists of several submodules that all are connected in series to a voltage source. The total dc-link voltage should split in a balanced way among the submodules. This does not always occur inherently. This paper presents an analysis of the capacitor voltage stability for the SPB converter. From the analysis, criteria for stability are derived and three alternatives of a suitable balancing controller are designed. The proposed controller alternatives and their associated stability properties are verified on an experimental setup and by simulation.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017
Keyword
Balancing control, dc-link stability, integrated electric drive, modular converter.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-185042 (URN)10.1109/TPEL.2016.2553129 (DOI)000388867300066 ()2-s2.0-84999273776 (Scopus ID)
Note

QC 20170119

Available from: 2016-04-10 Created: 2016-04-10 Last updated: 2017-11-30Bibliographically approved
Risseh, A. & Nee, H.-P. (2017). Design of a Thermoelectric Generator for Waste Heat Recovery Application on a Drivable Heavy Duty Vehicle. SAE International Journal of Commercial Vehicles, Article ID 2017-01-9178.
Open this publication in new window or tab >>Design of a Thermoelectric Generator for Waste Heat Recovery Application on a Drivable Heavy Duty Vehicle
2017 (English)In: SAE International Journal of Commercial Vehicles, ISSN 1946-391X, E-ISSN 1946-3928, ISSN 1946-3928, article id 2017-01-9178Article in journal (Refereed) Published
Abstract [en]

The European Union’s 2020 target aims to be producing 20 % of its energy from renewable sources by 2020, to achieve a 20 % reductionin greenhouse gas emissions and a 20 % improvement in energy efficiency compared to 1990 levels. To reach these goals, the energyconsumption has to decrease which results in reduction of the emissions. The transport sector is the second largest energy consumer in theEU, responsible for 25 % of the emissions of greenhouse gases caused by the low efficiency (<40 %) of combustion engines. Much workhas been done to improve that efficiency but there is still a large amount of fuel energy that converts to heat and escapes to the ambientatmosphere through the exhaust system. Taking advantage of thermoelectricity, the heat can be recovered, improving the fuel economy. Athermoelectric generator (TEG) consists of a number of thermoelectric elements, which advantageously can be built into modules,arranged thermally and electrically, in a way such that the highest possible thermal power can be converted into electrical power. In aunique waste heat recovery (WHR) project, five international companies and research institutes cooperated and equipped a fully drivableScania prototype truck with two TEGs. The entire system, from the heat transfer in the exchangers to the electrical power system, wassimulated, built and evaluated. The primary experimental results showed that approximately 1 kW electrical power could be generatedfrom the heat energy. In this paper the entire system from design to experimental results is presented.

Place, publisher, year, edition, pages
SAE International, 2017
Keyword
Thermoelectric generator, thermoelectricity, waste heat recovery, heavy duty vehicle, heat exchanger, power converter, internal combustion engine, power conditioning, vehicle exhaust, fuel economy
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering; Energy Technology
Identifiers
urn:nbn:se:kth:diva-222267 (URN)10.4271/2017-01-9178 (DOI)000408248100004 ()2-s2.0-85018282955 (Scopus ID)
Projects
Waste Heat recovery
Funder
Swedish Energy Agency, 76467
Note

QC 20170926

Available from: 2018-02-05 Created: 2018-02-05 Last updated: 2018-03-07Bibliographically approved
Risseh, A., Nee, H.-P. & Kostov, K. (2017). Electrical performance of directly attached SiC power MOSFET bare dies in a half-bridge configuration. In: 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017: . Paper presented at 3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017, Kaohsiung, Taiwan, 3 June 2017 through 7 June 2017 (pp. 417-421). Taiwan: Institute of Electrical and Electronics Engineers (IEEE), Article ID 7992074.
Open this publication in new window or tab >>Electrical performance of directly attached SiC power MOSFET bare dies in a half-bridge configuration
2017 (English)In: 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017, Taiwan: Institute of Electrical and Electronics Engineers (IEEE), 2017, p. 417-421, article id 7992074Conference paper, Published paper (Refereed)
Abstract [en]

The demand for high-efficiency power converters is increasing continuously. The switching losses are typically significant in power converters. During the switching time, the component is exposed to a considerable voltage and current causing power loss. The switching time is limited by parasitic inductance produced by traces and interconnections inside and outside the package of a device. Moreover, the parasitic inductances at the input-terminal together with the Miller capacitance generate oscillations causing instability and additional losses. In order to eliminate the package parasitic inductance, four 1.2kV SiC-MOSFET bare dies, two in parallel in each position, were directly attached to a PCB sandwich designed as a half bridge. The obtained structure forms a planar power module. From ANSYS Q3D simulations it was found that the parasitic inductance between drain and source for each transistor in the proposed planar module could be reduced 92 % compared to a TO247 package. The planar module was also tested as a dc-dc converter. Switching waveforms from these experiments are also presented.

Place, publisher, year, edition, pages
Taiwan: Institute of Electrical and Electronics Engineers (IEEE), 2017
Keyword
SiC MOSTEF, bare die, low inductive circuit, fast switching, parasitic inductance, converter, planar Module
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-211510 (URN)10.1109/IFEEC.2017.7992074 (DOI)000426696300073 ()2-s2.0-85034023937 (Scopus ID)978-1-5090-5157-1 (ISBN)
Conference
3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017, Kaohsiung, Taiwan, 3 June 2017 through 7 June 2017
Note

QC 20170810

Available from: 2017-08-04 Created: 2017-08-04 Last updated: 2018-03-23Bibliographically approved
Jacobs, K., Johannesson, D., Norrga, S. & Nee, H.-P. (2017). MMC Converter Cells Employing Ultrahigh-Voltage SiC Bipolar Power Semiconductors. In: 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE EUROPE): . Paper presented at 19th European Conference on Power Electronics and Applications (EPE ECCE Europe), SEP 11-14, 2017, Warsaw, Poland. Institute of Electrical and Electronics Engineers (IEEE)
Open this publication in new window or tab >>MMC Converter Cells Employing Ultrahigh-Voltage SiC Bipolar Power Semiconductors
2017 (English)In: 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE EUROPE), Institute of Electrical and Electronics Engineers (IEEE), 2017Conference paper, Published paper (Refereed)
Abstract [en]

This paper investigates the benefits of using high-voltage converter cells for transmission applications. These cells employ ultrahigh-voltage SiC bipolar power semiconductors, which are optimized for low conduction losses. The Modular Multilevel Converter with half-bridge cells is used as a test case. The results indicate a reduction of converter volume and complexity, while maintaining low losses and harmonic performance.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017
Series
European Conference on Power Electronics and Applications, ISSN 2325-0313
Keyword
HVDC transmission, Modular multilevel converters, Silicon carbide
National Category
Energy Systems
Identifiers
urn:nbn:se:kth:diva-220864 (URN)10.23919/EPE17ECCEEurope.2017.8099078 (DOI)000418374403001 ()2-s2.0-85042153261 (Scopus ID)978-9-0758-1527-6 (ISBN)
Conference
19th European Conference on Power Electronics and Applications (EPE ECCE Europe), SEP 11-14, 2017, Warsaw, Poland
Funder
SweGRIDS - Swedish Centre for Smart Grids and Energy Storage
Note

QC 20180109

Available from: 2018-01-09 Created: 2018-01-09 Last updated: 2018-03-16Bibliographically approved
Toth-Pal, Z., Zhang, Y., Hammam, T., Nee, H.-P. & Bakowski, M. (2017). Thermal improvement of Press-Pack Packages: Pressure Dependent Thermal Contact Resistance with a thin Silver Interlayer between Molybdenum substrate and Silicon Carbide chip. Paper presented at IEEE International Workshop on Integrated Power Packaging (IWIPP), APR 05-07, 2017, Delft, NETHERLANDS. 2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)
Open this publication in new window or tab >>Thermal improvement of Press-Pack Packages: Pressure Dependent Thermal Contact Resistance with a thin Silver Interlayer between Molybdenum substrate and Silicon Carbide chip
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2017 (English)In: 2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)Article in journal (Refereed) Published
Abstract [en]

In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

Place, publisher, year, edition, pages
IEEE, 2017
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-218243 (URN)10.1109/IWIPP.2017.7936753 (DOI)000414286300009 ()2-s2.0-85025660047 (Scopus ID)978-1-5090-4278-4 (ISBN)
Conference
IEEE International Workshop on Integrated Power Packaging (IWIPP), APR 05-07, 2017, Delft, NETHERLANDS
Note

QC 20171124

Available from: 2017-11-24 Created: 2017-11-24 Last updated: 2017-11-24Bibliographically approved
Zhang, H., Ängquist, L., Norrga, S., Nee, H.-P. & Östlund, S. (2016). Benchmark of high-power STATCOM topologies for flicker compensation. In: 2016 18TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'16 ECCE EUROPE): . Paper presented at 18th European Conference on Power Electronics and Applications (EPE), SEP 05-09, 2016, GERMANY. IEEE
Open this publication in new window or tab >>Benchmark of high-power STATCOM topologies for flicker compensation
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2016 (English)In: 2016 18TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'16 ECCE EUROPE), IEEE, 2016Conference paper, Published paper (Refereed)
Abstract [en]

The current from an electrical arc furnace (EAF) in a steel plant is highly unsymmetrical, i.e. it comprises a large amount of negative sequence. This causes problems with the voltage stability in the capacitor submodules for a static synchronous compensator (STATCOM), when implemented using the modular multilevel converter (M2C) concept. In order to counteract the uncontrollability of the capacitor voltage, a common practice is to circulate a zero-sequence fundamental current or a direct current. The method brings the benefit of re-balancing the active power among the individual phases while it requires over-rating of the valve current or dc voltage of the STATCOM. This would in practice give a more expensive design. This paper presents a benchmark of various M2C-based STATCOM designs considering the valve overrating. The STATCOM topologies will be benchmarked with the EAF modeled for all possible combinations of positive-and negative-sequence current. The rating comparison considering the dc capacitor ripple and zero-sequence harmonic injection are discussed.

Place, publisher, year, edition, pages
IEEE, 2016
Series
European Conference on Power Electronics and Applications, ISSN 2325-0313
Keyword
Static Synchronous Compensator (STATCOM), Multilevel Converters
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-197014 (URN)10.1109/EPE.2016.7695478 (DOI)000386637300227 ()2-s2.0-84996791605 (Scopus ID)
Conference
18th European Conference on Power Electronics and Applications (EPE), SEP 05-09, 2016, GERMANY
Note

QC 20161209

Available from: 2016-12-09 Created: 2016-11-28 Last updated: 2017-02-28Bibliographically approved
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ORCID iD: ORCID iD iconorcid.org/0000-0002-1755-1365

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