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Publications (10 of 46) Show all publications
Rahiminejad, S., Hansson, J., Kohler, E., van der Wijngaart, W., Haraldsson, K. T., Haasl, S. & Enoksson, P. (2017). Rapid manufacturing of OSTE polymer RF-MEMS components. In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS): . Paper presented at 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, 22 January 2017 through 26 January 2017 (pp. 901-904). IEEE
Open this publication in new window or tab >>Rapid manufacturing of OSTE polymer RF-MEMS components
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2017 (English)In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), IEEE, 2017, p. 901-904Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports the first RF-MEMS component in OSTE polymer. Three OSTE-based ridge gap resonators were fabricated by direct, high aspect ratio, photostructuring. The OSTE polymer's good adhesion to gold makes it suitable for RF-MEMS applications. The OSTE ridge gap resonators differ in how they were coated with gold. The OSTE-based devices are compared to each other as well as to Si-based, SU8-based, and CNT-based devices of equal design. The OSTE-based process was performed outside the cleanroom, and with a fast fabrication process (∼1 h). The OSTE-based device performance is on par with that of the other alternatives in terms of frequency, attenuation, and Q-factor.

Place, publisher, year, edition, pages
IEEE, 2017
Keywords
Aspect ratio, Gold, Gold coatings, Mechanics, Polymers, Q factor measurement, Resonators, Device performance, Fabrication process, High aspect ratio, Q-factors, Rapid manufacturing, RF-MEMS, Si-based, MEMS
National Category
Textile, Rubber and Polymeric Materials
Identifiers
urn:nbn:se:kth:diva-207992 (URN)000402552000231 ()2-s2.0-85015753569 (Scopus ID)9781509050789 (ISBN)
Conference
30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, 22 January 2017 through 26 January 2017
Note

QC 20170607

Available from: 2017-06-07 Created: 2017-06-07 Last updated: 2017-11-29Bibliographically approved
Asiatici, M., Fischer, A. C., Rodjegard, H., Haasl, S., Stemme, G. & Niklaus, F. (2016). Capacitive inertial sensing at high temperatures of up to 400 degrees C. Sensors and Actuators A-Physical, 238, 361-368
Open this publication in new window or tab >>Capacitive inertial sensing at high temperatures of up to 400 degrees C
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2016 (English)In: Sensors and Actuators A-Physical, ISSN 0924-4247, E-ISSN 1873-3069, Vol. 238, p. 361-368Article in journal (Refereed) Published
Abstract [en]

High-temperature-resistant inertial sensors are increasingly requested in a variety of fields such as aerospace, automotive and energy. Capacitive detection is especially suitable for sensing at high temperatures due to its low intrinsic temperature dependence. In this paper, we present high-temperature measurements utilizing a capacitive accelerometer, thereby proving the feasibility of capacitive detection at temperatures of up to 400 degrees C. We describe the observed characteristics as the temperature is increased and propose an explanation of the physical mechanisms causing the temperature dependence of the sensor, which mainly involve the temperature dependence of the Young's modulus and of the viscosity and the pressure of the gas inside the sensor cavity. Therefore a static electromechanical model and a dynamic model that takes into account squeeze film damping were developed.

Place, publisher, year, edition, pages
Elsevier, 2016
Keywords
High temperature, Harsh environment, Inertial sensors, Capacitive detection, Accelerometer
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-183657 (URN)10.1016/j.sna.2015.12.025 (DOI)000370306100040 ()2-s2.0-84954190617 (Scopus ID)
Funder
Knut and Alice Wallenberg FoundationEU, European Research Council, 277879
Note

QC 20160319

Available from: 2016-03-19 Created: 2016-03-18 Last updated: 2018-04-11Bibliographically approved
Rahiminejad, S., Pucci, E., Vassilev, V., Kildal, P.-S., Haasl, S. & Enoksson, P. (2016). Polymer Gap Adapter for Contactless, Robust, and Fast Measurements at 220-325 GHz. Journal of microelectromechanical systems, 25(1), 160-169
Open this publication in new window or tab >>Polymer Gap Adapter for Contactless, Robust, and Fast Measurements at 220-325 GHz
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2016 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 25, no 1, p. 160-169Article in journal (Refereed) Published
Abstract [en]

Radiation leakages are a considerable problem when measuring waveguide structures at high frequencies. In order to maintain good electrical contact, flanges need to be tightly and evenly screwed to the device under test. This can be a time-consuming operation, especially with repeated measurements. We present a metamaterial-based adapter, which prohibits leakage even in the presence of gaps at the interconnects. This so-called gap adapter has been fabricated from a metallized polymer (SU8). The reflection coefficient is below -20 dB throughout the band for a 50-mu m gap on both sides of the gap adapter. In comparison, a conventional waveguide with a 50-mu m gap on both sides has a reflection coefficient of -10 dB. The gap adapter can be used to perform fast measurements, since the normal flange screws are redundant. We compare the SU8 gap adapter with a Si version and to a smooth metal waveguide reference disc. The SU8 gap adapter performed better than the Si version and much better than the waveguide disc in all test cases. SU8 gap adapters were used to measure on a waveguide component. The SU8 gap adapters with 50-mu m gaps performed comparable with the waveguide component with the flange screws carefully tightened. The polymer also makes the gap adapter mechanically robust and easy to mass fabricate. [2015-0113]

Place, publisher, year, edition, pages
IEEE Press, 2016
Keywords
Gap waveguide, GHz, high-frequency, measurement adapters, microelectromechanical systems (MEMS), metamaterial, micromachining, pin flange, polymer, radio frequency (RF), Si, SU8
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-183651 (URN)10.1109/JMEMS.2015.2500277 (DOI)000370763900017 ()
Funder
Swedish Research CouncilEU, European Research Council, ERC-2012-ADG 20120216
Note

QC 20160319.

Available from: 2016-03-19 Created: 2016-03-18 Last updated: 2017-11-30Bibliographically approved
Rahiminejad, S., Pucci, E., Haasl, S. & Enoksson, P. (2014). Micromachined contactless pin-flange adapter for robust high-frequency measurements. Paper presented at 24th MicroMechanics and Microsystems Europe Conference (MME), SEP 01-04, 2013, Espoo, FINLAND. Journal of Micromechanics and Microengineering, 24(8), 084004
Open this publication in new window or tab >>Micromachined contactless pin-flange adapter for robust high-frequency measurements
2014 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 24, no 8, p. 084004-Article in journal (Refereed) Published
Abstract [en]

We present the first micromachined double-sided contactless WR03 pin-flange adapter for 220-325 GHz based on gap waveguide technology. The pin-flange adapter is used to avoid leakage at the interface of two waveguides even when a gap between them is present and can be fitted onto any standard WR03 waveguide flange. Tolerance measurements were performed with gaps ranging from 30-100 mu m. The performance of the micromachined pin flange has been compared to a milled pin flange, a choke flange and to standard waveguide connections. The micromachined pin flange is shown to have better performance than the standard connection and similar performance to the milled pin flange and choke flange. The benefits of micromachining over milling are the possibility to mass produce pin flanges and the better accuracy in the 2D design. Measurements were performed with and without screws fixing the flanges. The flanges have also been applied to measure two devices, a straight rectangular waveguide of 1.01 inch and a ridge gap resonator. In all cases, the micromachined pin flange performed flawlessly while the standard flange experienced significant losses at already small gaps.

Keywords
GHz, RF MEMS, metamaterial, gap waveguide, high-frequency measurement, pin-flange adapter, micromachining
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-156135 (URN)10.1088/0960-1317/24/8/084004 (DOI)000343413400005 ()2-s2.0-84906080908 (Scopus ID)
Conference
24th MicroMechanics and Microsystems Europe Conference (MME), SEP 01-04, 2013, Espoo, FINLAND
Available from: 2014-12-08 Created: 2014-11-21 Last updated: 2017-12-05Bibliographically approved
Rahiminejad, S., Pucci, E., Haasl, S. & Enoksson, P. (2014). SU8 ridge-gap waveguide resonator. International journal of microwave and wireless technologies, 6(5), 459-465
Open this publication in new window or tab >>SU8 ridge-gap waveguide resonator
2014 (English)In: International journal of microwave and wireless technologies, ISSN 1759-0795, E-ISSN 1759-0787, Vol. 6, no 5, p. 459-465Article in journal (Refereed) Published
Abstract [en]

In this paper, we present the first ridge-gap waveguide resonator made with a polymer base. It is designed for the frequency range 220-325 GHz, and is fabricated solely using a Au coated two-layer SU8-based process. The design is based on previous work done with Si. The new process has advantages such as fewer and cheaper process steps. The SU8 ridge-gap waveguide resonator is made in order to obtain attenuation characteristics via the measured Q-factor of the resonator. The ridge-gap waveguide resonator has the same dimensions as the previous one fabricated in Si, and the same thickness of the Au coating. The SU8-based resonator shows an attenuation loss of 0.41 dB/mm at 282.2 GHz compared to the Si-based resonator with an attenuation loss of 0.043 dB/mm at 283.5 GHz. This makes the SU8 process a more cost-effective alternative to the Si process

Keywords
RF-MEMS and MOEMS, New and emerging technologies and materials
National Category
Telecommunications
Identifiers
urn:nbn:se:kth:diva-159034 (URN)10.1017/S1759078714000609 (DOI)000346348200003 ()2-s2.0-84911961757 (Scopus ID)
Funder
Swedish Research CouncilVINNOVA
Note

QC 20150203

Available from: 2015-02-03 Created: 2015-01-20 Last updated: 2017-12-05Bibliographically approved
Rahiminejad, S., Brazalez, A. A., Raza, H., Pucci, E., Haasl, S., Kildal, P.-S. -. & Enoksson, P. (2013). 100 GHz SOI gap waveguides. In: 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013. Paper presented at 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013 (pp. 510-513).
Open this publication in new window or tab >>100 GHz SOI gap waveguides
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2013 (English)In: 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013, 2013, p. 510-513Conference paper, Published paper (Refereed)
Abstract [en]

Two gap waveguide technologies, groove and ridge, are presented here for F-band applications. Three different groove gap waveguide devices and four different ridge gap waveguide devices have been fabricated. All of them were micromachined to achieve the feature size required for the frequency band and fabricated in a single process using SOI wafers. The two types provide a more robust coupling to standard waveguides and high frequency probes. Measurements for most of the devices are shown in this paper, showing robust measurements and good agreement with simulations. More measurements need to be done but the initial ones show the promise both in the manufacturing technique and the coupling.

Keywords
Bed of nails, Gap Waveguide, Groove, High-frequency, Micromachining, Ridge, Waveguide
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-140956 (URN)10.1109/Transducers.2013.6626815 (DOI)2-s2.0-84891720407 (Scopus ID)978-146735981-8 (ISBN)
Conference
2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013
Note

QC 20140205

Available from: 2014-02-05 Created: 2014-02-05 Last updated: 2014-02-05Bibliographically approved
Askfors, Y., Hollmark, M., Haasl, S. & Guve, B. (2013). Learning In Interdisciplinary Networks - For An Efficient Innovation System And An Improved Healthcare. In: ICERI 2013: conference proceedings. Paper presented at 6th International Conference of Education, Research and Innovation Seville - 18th-20th November 2013, Spain (pp. 1000-1007). International Association of Technology, Education and Development, IATED
Open this publication in new window or tab >>Learning In Interdisciplinary Networks - For An Efficient Innovation System And An Improved Healthcare
2013 (English)In: ICERI 2013: conference proceedings, International Association of Technology, Education and Development, IATED , 2013, p. 1000-1007Conference paper, Published paper (Refereed)
Abstract [en]

Clinical Innovation Fellowships is a program that creates conditions for learning and for innovative thought to take place. It aims to educate innovators and to develop innovations that result in more efficient healthcare production. [1] Multiprofessional 4-person-teams of fellow candidates with competence in engineering, medicine, industrial design and management work together full time for eight months, with the aim to identify clinical needs that can be met by a medical technology innovation (process, product or service) or by an organizational improvement. Early in the program, the team spends two months full time at a clinical department observing the various healthcare activities. Among the clinical needs identified by the fellow candidates three needs will be chosen, validated and approved by the department's management as appropriate starting points for student thesis projects. We describe the phenomenon we have seen when introducing new disciplines as observers and problem solvers in a healthcare context as the improbable dialogue. The improbable dialogue is the unexpected dialogue between professionals and students, or professionals within separate disciplinary boundaries that generally never meet professionally. Such a dialogue may however be the channel in which the curiosity and openness of a novice can reflect on the daily work of a specialist, ultimately resulting in the development of ideas, knowledge exchange and learning. The Clinical Innovation Fellowships program enables this learning to take place and has shown to be a successful catalyst for the improbable dialogue; the unexpected, interdisciplinary, dialogue between healthcare specialists, high qualified fellow candidates with working experience and thesis students from different educational fields. This paper gives a qualitative problematization of the program with respect to the strategy and method of including thesis students to reinforce (almost) any innovation system through interdisciplinary, multiprofessional collaboration, where healthcare and academy learn from each other.

Place, publisher, year, edition, pages
International Association of Technology, Education and Development, IATED, 2013
Keywords
Innovation, multi-professional collaboration, healthcare, medical technology
National Category
Educational Sciences
Identifiers
urn:nbn:se:kth:diva-134863 (URN)000347240601010 ()978-84-616-3847-5 (ISBN)
Conference
6th International Conference of Education, Research and Innovation Seville - 18th-20th November 2013, Spain
Note

QC 20140619

Available from: 2013-12-30 Created: 2013-11-30 Last updated: 2015-12-03Bibliographically approved
Rahiminejad, S., Raza, H., Zaman, A. U., Haasl, S., Enoksson, P. & Kildal, P.-S. -. (2013). Micromachined gap waveguides for 100 GHz applications. In: 2013 7th European Conference on Antennas and Propagation, EuCAP 2013: . Paper presented at 2013 7th European Conference on Antennas and Propagation, EuCAP 2013; Gothenburg; Sweden; 8 April 2013 through 12 April 2013 (pp. 1935-1938). EurAAP
Open this publication in new window or tab >>Micromachined gap waveguides for 100 GHz applications
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2013 (English)In: 2013 7th European Conference on Antennas and Propagation, EuCAP 2013, EurAAP , 2013, p. 1935-1938Conference paper, Published paper (Refereed)
Abstract [en]

The present paper demonstrates groove gap waveguides at around 100 GHz, fabricated on Gold-plated micromachined silicon. Three different groove gap waveguides have been manufactured and measured: a resonator for determining Q-factor and thereby attenuation, a straight waveguide, and a waveguide with two 90 degree bends.

Place, publisher, year, edition, pages
EurAAP, 2013
Keywords
Bed of nails, Gap Waveguide, Groove, High-frequency, Micromachining, Waveguide
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-133882 (URN)2-s2.0-84881291912 (Scopus ID)978-889070183-2 (ISBN)
Conference
2013 7th European Conference on Antennas and Propagation, EuCAP 2013; Gothenburg; Sweden; 8 April 2013 through 12 April 2013
Note

QC 20131112

Available from: 2013-11-12 Created: 2013-11-11 Last updated: 2013-11-12Bibliographically approved
Schröder, S., Nafari, A., Persson, K., Westby, E., Fischer, A. C., Stemme, G., . . . Haasl, S. (2013). Stress-minimized packaging of inertial sensors using wire bonding. In: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). Paper presented at 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013 (pp. 1962-1965). IEEE conference proceedings
Open this publication in new window or tab >>Stress-minimized packaging of inertial sensors using wire bonding
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2013 (English)In: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), IEEE conference proceedings, 2013, p. 1962-1965Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents a packaging approach for inertial sensors using wire bonding technology. The die is mounted exclusively by bond wires on the front- and backside to the package. Conventional single-side die attach to substrates, such as gluing, is abandoned. The approach is characterized by its novel and symmetric die attach concept as well as its simplicity of applying a standard wire bonding process. The wire bond attachment facilitates significant reduction of thermally induced mechanical stresses. The attachment concept is characterized in terms of attachment stiffness and potential die resonances using Laser Doppler Vibrometry(LDV). White-light interferometry is used to investigate stress related warping that is induced by the die attachment process.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2013
Keywords
Low-stress, die attach, wire bonding, inertial sensors, Laser Doppler Vibrometry, white-light interferometry, packaging
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-129738 (URN)10.1109/Transducers.2013.6627179 (DOI)2-s2.0-84891708939 (Scopus ID)978-1-4673-5983-2 (ISBN)
Conference
2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013
Note

QC 20131030

Available from: 2013-10-04 Created: 2013-10-04 Last updated: 2018-02-07Bibliographically approved
Haasl, S., Enoksson, P. & Kildal, P.-S. (2012). Fabrication method for high-frequency components. .
Open this publication in new window or tab >>Fabrication method for high-frequency components
2012 (English)Patent (Other (popular science, discussion, etc.))
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-159463 (URN)
Note

QS 201504

Available from: 2015-01-31 Created: 2015-01-31 Last updated: 2015-04-09Bibliographically approved
Organisations
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0002-9327-2544

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