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Publications (10 of 85) Show all publications
Ottonello Briano, F., Errando-Herranz, C., Rödjegård, H., Martin, H., Sohlström, H. & Gylfason, K. (2020). Carbon dioxide absorption spectroscopy with a mid-infrared silicon photonic waveguide. Optics Letters, 45(1), 109-112
Open this publication in new window or tab >>Carbon dioxide absorption spectroscopy with a mid-infrared silicon photonic waveguide
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2020 (English)In: Optics Letters, ISSN 0146-9592, E-ISSN 1539-4794, Vol. 45, no 1, p. 109-112Article in journal (Refereed) Published
Abstract [en]

Carbon dioxide (CO2) is a gas vital for life on Earth. It is also a waste product of human activities and is widely used in agriculture and industry. Its accurate sensing is therefore of great interest. Optical sensors exploiting the mid-infrared light absorption of CO2 provide high selectivity, but their large size and high cost limit their use. In this Letter, we demonstrate CO2 gas sensing at 4.2 µm wavelength using an integrated silicon waveguide, featuring a sensitivity to CO2 of 44% that of free-space sensing. The suspended waveguide is fabricated on a silicon-on-insulator substrate by a single-lithography-step process, and we route it into a mid-infrared photonic circuit for on-chip-referenced gas measurements. Its demonstrated performance and its simple and scalable fabrication make our waveguide ideal for integration in miniaturized CO2 sensors for distributed environmental monitoring, personal safety, and medical and high-volume consumer applications.

Keywords
Carbon dioxide, mid-IR, waveguide, gas sensor, integrated optics, silicon photonics, MEMS.
National Category
Atom and Molecular Physics and Optics
Identifiers
urn:nbn:se:kth:diva-265603 (URN)10.1364/OL.45.000109 (DOI)2-s2.0-85077514845 (Scopus ID)
Funder
Vinnova, 2016-02328Vinnova, 2017-05108Stockholm County Council, 2015091Swedish Foundation for Strategic Research , GMT14-0071
Available from: 2019-12-18 Created: 2019-12-18 Last updated: 2020-03-09Bibliographically approved
Quack, N., Sattari, H., Takabayashi, A. Y., Zhang, Y., Verheyen, P., Bogaerts, W., . . . Gylfason, K. (2020). MEMS-Enabled Silicon Photonic Integrated Devices and Circuits. IEEE Journal of Quantum Electronics, 56(1), Article ID 8400210.
Open this publication in new window or tab >>MEMS-Enabled Silicon Photonic Integrated Devices and Circuits
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2020 (English)In: IEEE Journal of Quantum Electronics, ISSN 0018-9197, E-ISSN 1558-1713, Vol. 56, no 1, article id 8400210Article in journal (Refereed) Published
Abstract [en]

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process.

Place, publisher, year, edition, pages
IEEE, 2020
Keywords
Integrated optics, microelectromechanical systems, nanophotonics, photonic integrated circuits, silicon photonics
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-266180 (URN)10.1109/JQE.2019.2946841 (DOI)000501604100001 ()2-s2.0-85077388014 (Scopus ID)
Note

QC 20200114

Available from: 2020-01-14 Created: 2020-01-14 Last updated: 2020-01-14Bibliographically approved
Smith, A. D., Li, Q., Vyas, A., Haque, M. M., Wang, K., Velasco, A., . . . Enoksson, P. (2019). Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development. Sensors, 19(19), Article ID 4231.
Open this publication in new window or tab >>Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development
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2019 (English)In: Sensors, ISSN 1424-8220, E-ISSN 1424-8220, Vol. 19, no 19, article id 4231Article in journal (Refereed) Published
Abstract [en]

There is an urgent need to fulfill future energy demands for micro and nanoelectronics. This work outlines a number of important design features for carbon-based microsupercapacitors, which enhance both their performance and integration potential and are critical for complimentary metal oxide semiconductor (CMOS) compatibility. Based on these design features, we present CMOS-compatible, graphene-based microsupercapacitors that can be integrated at the back end of the line of the integrated circuit fabrication. Electrode materials and their interfaces play a crucial role for the device characteristics. As such, different carbon-based materials are discussed and the importance of careful design of current collector/electrode interfaces is emphasized. Electrode adhesion is an important factor to improve device performance and uniformity. Additionally, doping of the electrodes can greatly improve the energy density of the devices. As microsupercapacitors are engineered for targeted applications, device scaling is critically important, and we present the first steps toward general scaling trends. Last, we outline a potential future integration scheme for a complete microsystem on a chip, containing sensors, logic, power generation, power management, and power storage. Such a system would be self-powering.

Keywords
energy storage, IoT, microsupercapacitors, self-powering systems, sensor networks
National Category
Nano Technology Other Electrical Engineering, Electronic Engineering, Information Engineering Energy Engineering
Identifiers
urn:nbn:se:kth:diva-261098 (URN)10.3390/s19194231 (DOI)000494823200175 ()31569477 (PubMedID)2-s2.0-85072778122 (Scopus ID)
Note

QC 20191106

Available from: 2019-10-01 Created: 2019-10-01 Last updated: 2020-03-09Bibliographically approved
Quack, N., Sattari, H., Takabayashi, A. Y., Zhang, Y., Errando-Herranz, C., Edinger, P. & Gylfason, K. (2019). Exploiting Mechanics at the Micro- and Nanoscale for Efficient Reconfiguration of Photonic Integrated Circuits. In: IEEE Photonics Society Summer Topical Meeting Series 2019, SUM 2019: . Paper presented at 2019 IEEE Photonics Society Summer Topical Meeting Series, SUM 2019; The Westin Fort Lauderdale Beach ResortFort Lauderdale; United States; 8 July 2019 through 10 July 2019 (pp. 1-1). , Article ID 8795036.
Open this publication in new window or tab >>Exploiting Mechanics at the Micro- and Nanoscale for Efficient Reconfiguration of Photonic Integrated Circuits
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2019 (English)In: IEEE Photonics Society Summer Topical Meeting Series 2019, SUM 2019, 2019, p. 1-1, article id 8795036Conference paper, Published paper (Refereed)
Abstract [en]

We exploit Micro- & Nano-Electro-Mechanical Systems in Photonic Integrated Circuits to perform basic photonic operations, including phase shifting, attenuation and switching. Due to their small footprint and low insertion loss, Photonic MEMS are highly scalable, while mechanical latching mechanisms can offer zero steady state power consumption.

Keywords
silicon photonics, MEMS, reconfigurable photonics, integrated photonics
National Category
Nano Technology Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-258913 (URN)10.1109/PHOSST.2019.8795036 (DOI)2-s2.0-85071693478 (Scopus ID)
Conference
2019 IEEE Photonics Society Summer Topical Meeting Series, SUM 2019; The Westin Fort Lauderdale Beach ResortFort Lauderdale; United States; 8 July 2019 through 10 July 2019
Projects
MORPHIC
Note

QC 20191029

Available from: 2019-09-11 Created: 2019-09-11 Last updated: 2019-10-29Bibliographically approved
Quack, N., Sattari, H., Takabayashi, A. Y., Zhang, Y., Edinger, P., Errando-Herranz, C., . . . Bogaerts, W. (2019). Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits. In: 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings: . Paper presented at 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019; San Diego; United States; 3 March 2019 through 7 March 2019 (pp. 1-3). Institute of Electrical and Electronics Engineers (IEEE), Article ID 8696652.
Open this publication in new window or tab >>Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits
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2019 (English)In: 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings, Institute of Electrical and Electronics Engineers (IEEE), 2019, p. 1-3, article id 8696652Conference paper, Published paper (Refereed)
Abstract [en]

With the maturing and the increasing complexity of Silicon Photonics technology, novel avenues are pursued to reduce power consumption and to provide enhanced functionality: exploiting mechanical movement in advanced Silicon Photonic Integrated Circuits provides a promising path to access a strong modulation of the effective index and to low power consumption by employing mechanically stable and thus non-volatile states. In this paper, we will discuss recent achievements in the development of MEMS enabled systems in Silicon Photonics and outline the roadmap towards reconfigurable general Photonic Integrated Circuits.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2019
Keywords
integrated optics, silicon photonics, MEMS, reconfigurable photonics
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Nano Technology
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-258915 (URN)2-s2.0-85065483032 (Scopus ID)978-1-943580-53-8 (ISBN)
Conference
2019 Optical Fiber Communications Conference and Exhibition, OFC 2019; San Diego; United States; 3 March 2019 through 7 March 2019
Projects
MORPHIC
Note

QC 20191112

Available from: 2019-09-11 Created: 2019-09-11 Last updated: 2019-12-04Bibliographically approved
Edinger, P., Errando-Herranz, C. & Gylfason, K. (2019). Low-loss MEMS phase shifter for large scale reconfigurable silicon photonics. In: : . Paper presented at The 32nd IEEE International Conference on Micro Electro Mechanical Systems.
Open this publication in new window or tab >>Low-loss MEMS phase shifter for large scale reconfigurable silicon photonics
2019 (English)Conference paper, Poster (with or without abstract) (Refereed)
Abstract [en]

We experimentally demonstrate a silicon MEMS phase shifter achieving more than π phase shift with sub-dB insertion loss (IL).  The phase is tuned by reducing the gap between a static suspended waveguide and a free silicon beam, via comb-drive actuation.  Our device reaches 1.2π phase shift at only 20 V, with only 0.3 dB insertion loss – an order of magnitude improvement over previously reported MEMS devices.  The device has a small footprint of 50×70 µm2 and its power consumption is 5 orders of magnitude lower than that of traditional thermal phase shifters.  Our new phase shifter is a fundamental building block of the next-generation large scale reconfigurable photonic circuits which will find applications in datacenter interconnects, artificial intelligence (AI), and quantum computing.

Keywords
silicon photonics, reconfigurable photonics, photonic mems
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-246037 (URN)
Conference
The 32nd IEEE International Conference on Micro Electro Mechanical Systems
Projects
Morphic
Note

QC 20190312

Available from: 2019-03-11 Created: 2019-03-11 Last updated: 2019-03-12Bibliographically approved
Errando-Herranz, C., Le Thomas, N. & Gylfason, K. (2019). Low-power optical beam steering by microelectromechanical waveguide gratings. Optics Letters, 44(4), 855-858
Open this publication in new window or tab >>Low-power optical beam steering by microelectromechanical waveguide gratings
2019 (English)In: Optics Letters, ISSN 0146-9592, E-ISSN 1539-4794, Vol. 44, no 4, p. 855-858Article in journal (Refereed) Published
Abstract [en]

Optical beam steering is key for optical communications, laser mapping (lidar), and medical imaging. For these applications, integrated photonics is an enabling technology that can provide miniaturized, lighter, lower-cost, and more power-efficient systems. However, common integrated photonic devices are too power demanding. Here, we experimentally demonstrate, for the first time, to the best of our knowledge, beam steering by microelectromechanical (MEMS) actuation of a suspended silicon photonic waveguide grating. Our device shows up to 5.6 degrees beam steering with 20 V actuation and power consumption below the mu W level, i.e., more than five orders of magnitude lower power consumption than previous thermo-optic tuning methods. The novel combination of MEMS with integrated photonics presented in this work lays ground for the next generation of power-efficient optical beam steering systems.

Place, publisher, year, edition, pages
OPTICAL SOC AMER, 2019
National Category
Accelerator Physics and Instrumentation
Identifiers
urn:nbn:se:kth:diva-245134 (URN)10.1364/OL.44.000855 (DOI)000458786800034 ()30768004 (PubMedID)2-s2.0-85061536509 (Scopus ID)
Note

QC 20190313

Available from: 2019-03-13 Created: 2019-03-13 Last updated: 2019-03-18Bibliographically approved
Edinger, P., Errando-Herranz, C. & Gylfason, K. (2019). Reducing Actuation Nonlinearity of MEMS Phase Shifters for Reconfigurable Photonic Circuits. In: 2019 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO): . Paper presented at Conference on Lasers and Electro-Optics (CLEO), MAY 05-10, 2019, San Jose, CA. IEEE
Open this publication in new window or tab >>Reducing Actuation Nonlinearity of MEMS Phase Shifters for Reconfigurable Photonic Circuits
2019 (English)In: 2019 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), IEEE , 2019Conference paper, Published paper (Refereed)
Abstract [en]

The low power consumption of MEMS actuators enables large-scale reconfigurable photonic circuits. However, insertion loss and actuation linearity need improvement. By simulations and experiments, we analyze the dominating design parameters affecting linearity and suggest improvements.

Place, publisher, year, edition, pages
IEEE, 2019
Series
Conference on Lasers and Electro-Optics, ISSN 2160-9020
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-259470 (URN)10.1364/CLEO_SI.2019.SF2H.3 (DOI)000482226300325 ()2-s2.0-85069169657 (Scopus ID)978-1-943580-57-6 (ISBN)
Conference
Conference on Lasers and Electro-Optics (CLEO), MAY 05-10, 2019, San Jose, CA
Note

QC 20190918

Available from: 2019-09-18 Created: 2019-09-18 Last updated: 2020-04-14Bibliographically approved
Bleiker, S. J., Dubois, V. J., Schröder, S., Ottonello Briano, F., Gylfason, K. B., Stemme, G. & Niklaus, F. (2018). Adhesive Wafer Bonding for Heterogeneous System Integration. In: The Electrochemical Society (Ed.), ECS Meeting Abstracts: . Paper presented at Americas International Meeting on Electrochemistry and Solid State Science (AiMES 2018).
Open this publication in new window or tab >>Adhesive Wafer Bonding for Heterogeneous System Integration
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2018 (English)In: ECS Meeting Abstracts / [ed] The Electrochemical Society, 2018Conference paper, Oral presentation with published abstract (Refereed)
Keywords
Adhesive wafer bonding, Wafer bonding, Integration, Hetergeneous integration, MEMS, NEMS, CMOS
National Category
Manufacturing, Surface and Joining Technology Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-253894 (URN)
Conference
Americas International Meeting on Electrochemistry and Solid State Science (AiMES 2018)
Note

QC 20190624

Available from: 2019-06-19 Created: 2019-06-19 Last updated: 2019-06-24Bibliographically approved
Quellmalz, A., Smith, A. D., Elgammal, K., Fan, X., Delin, A., Östling, M., . . . Niklaus, F. (2018). Influence of Humidity on Contact Resistance in Graphene Devices. ACS Applied Materials and Interfaces, 10(48), 41738-41746
Open this publication in new window or tab >>Influence of Humidity on Contact Resistance in Graphene Devices
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2018 (English)In: ACS Applied Materials and Interfaces, ISSN 1944-8244, E-ISSN 1944-8252, Vol. 10, no 48, p. 41738-41746Article in journal (Refereed) Published
Abstract [en]

The electrical contact resistance at metal–graphene interfaces can significantly degrade the properties of graphene devices and is currently hindering the full exploitation of graphene’s potential. Therefore, the influence of environmental factors, such as humidity, on the metal–graphene contact resistance is of interest for all graphene devices that operate without hermetic packaging. We experimentally studied the influence of humidity on bottom-contacted chemical-vapor-deposited (CVD) graphene–gold contacts, by extracting the contact resistance from transmission line model (TLM) test structures. Our results indicate that the contact resistance is not significantly affected by changes in relative humidity (RH). This behavior is in contrast to the measured humidity sensitivity  of graphene’s sheet resistance. In addition, we employ density functional theory (DFT) simulations to support our experimental observations. Our DFT simulation results demonstrate that the electronic structure of the graphene sheet on top of silica is much more sensitive to adsorbed water molecules than the charge density at the interface between gold and graphene. Thus, we predict no degradation of device performance by alterations in contact resistance when such contacts are exposed to humidity. This knowledge underlines that bottom-contacting of graphene is a viable approach for a variety of graphene devices and the back end of the line integration on top of conventional integrated circuits.

Place, publisher, year, edition, pages
American Chemical Society (ACS), 2018
Keywords
graphene, bottom-contact, contact resistance, humidity sensitivity, integration, sheet resistance
National Category
Nano Technology Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-232554 (URN)10.1021/acsami.8b10033 (DOI)000452694100088 ()30387599 (PubMedID)2-s2.0-85057551886 (Scopus ID)
Funder
VINNOVA, 2016-01655 2017-05108Swedish Research Council, VR 2015-04608 VR 2016-05980Swedish Energy Agency, STEM P40147-1 STEM P40147-1EU, European Research Council, 277879 307311
Note

QC 20181207

Available from: 2018-07-25 Created: 2018-07-25 Last updated: 2019-01-08Bibliographically approved
Organisations
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0001-9008-8402

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