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Publications (10 of 23) Show all publications
Jin, Y., Shen, J., Nejad, M. B., Xie, L., Zou, Z., Mao, J., . . . Zheng, L. (2017). A Power management scheme for wirelessly-powered RFID tags with inkjet-printed display. In: 2017 IEEE International Conference on RFID Technology and Application, RFID-TA 2017: . Paper presented at 2017 IEEE International Conference on RFID Technology and Application, RFID-TA 2017, Warsaw, Poland, 20 September 2017 through 22 September 2017 (pp. 180-185). Institute of Electrical and Electronics Engineers (IEEE)
Open this publication in new window or tab >>A Power management scheme for wirelessly-powered RFID tags with inkjet-printed display
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2017 (English)In: 2017 IEEE International Conference on RFID Technology and Application, RFID-TA 2017, Institute of Electrical and Electronics Engineers (IEEE), 2017, p. 180-185Conference paper, Published paper (Refereed)
Abstract [en]

This work proposes a new power management scheme for wirelessly-powered UHF RFID tags with flexible inkjet-printed Electrochromic (EC) display for human-to-device interaction. EC display on polyimide substrate is integrated at tag side to provide an ambient and direct human-to-device display interface. An aggressive duty-cycling power management scheme with dual supplies is designed to drive the EC display under the tag power budget in microwatt level through RF energy harvesting. In this scheme, energy for display refreshing is accumulated over multiple power management cycles. A single-pixel addressing scheme with minimal pixel size is proposed to further reduce display power and improve tag sensitivity by exploiting EC display bi-stability. The experimental results show that the EC display can be refreshed with the tag sensitivity of -10.5 dBm at 11.7 sec/cm2 update rate.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-221972 (URN)10.1109/RFID-TA.2017.8098640 (DOI)000426937500034 ()2-s2.0-85040721930 (Scopus ID)9781538618332 (ISBN)
Conference
2017 IEEE International Conference on RFID Technology and Application, RFID-TA 2017, Warsaw, Poland, 20 September 2017 through 22 September 2017
Note

QC 20180130

Available from: 2018-01-30 Created: 2018-01-30 Last updated: 2020-02-25Bibliographically approved
Shen, J., Mao, J., Yang, G., Xie, L., Feng, Y., Nejad, M., . . . Zheng, L. (2015). A 180 nm-CMOS Asymmetric UWB-RFID Tag with Real-time Remote-monitored ECG-sensing. In: Proceedings of the International Conference on Biomedical Electronics and Devices: . Paper presented at The International Conference on Biomedical Electronics and Devices, 2015, Lisbon, Portugal (pp. 210-215).
Open this publication in new window or tab >>A 180 nm-CMOS Asymmetric UWB-RFID Tag with Real-time Remote-monitored ECG-sensing
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2015 (English)In: Proceedings of the International Conference on Biomedical Electronics and Devices, 2015, p. 210-215Conference paper, Published paper (Refereed)
Abstract [en]

This paper proposes an asymmetric ultra-wideband - radio frequency identification (UWB-RFID) tag with electrocardiogram (ECG)-sensing capability for patients remote-monitoring in hospital environment. A UWB-RFID communication protocol is suggested for real-time transmission of undistorted ECG by interleaving ADC sampling and burst-mode UWB transmission. The proposed system shows a maximum accessing capability of 400 tags/second at 1.5 KHz ECG sampling rate with 10 Mbps UWB pulse rate. The tag consists of UHF-RFID receiver, UWB transmitter, ECG analog front-end, multi-input ADC and baseband circuitry integrated on two silicon dies. It was implemented by 6 mm2 -sized 180 nm CMOS technology. Electrodes for ECG-sensing are manufactured by inkjet-printing on polyimide substrate. Experiment results show that the tag transmits UWB pulses at 1 Mbps rate with 18 µW power. The printed electrodes conduct ECG waveform comparable to commercial electrodes.

Keywords
Real-Time Remote-Monitoring, Electrocardiogram (ECG), Asymmetric Ultra-Wideband - Radio Frequency Identification (UWB-RFID), Inkjet-Printed Electrodes
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-175318 (URN)10.5220/0005286302100215 (DOI)000380546700033 ()2-s2.0-84936762426 (Scopus ID)978-989-758-071-0 (ISBN)
Conference
The International Conference on Biomedical Electronics and Devices, 2015, Lisbon, Portugal
Note

QC 20151012

Available from: 2015-10-12 Created: 2015-10-12 Last updated: 2019-09-20Bibliographically approved
Feng, Y., Xie, L., Chen, Q. & Zheng, L.-R. (2015). Low Cost Printed Chipless RFID Humidity Sensor Tag for Intelligent Packaging. IEEE Sensors Journal, 15(6), 3201-3208
Open this publication in new window or tab >>Low Cost Printed Chipless RFID Humidity Sensor Tag for Intelligent Packaging
2015 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 15, no 6, p. 3201-3208Article in journal (Refereed) Published
Abstract [en]

This paper presents a fully-printed chipless radio frequency identification sensor tag for short-range item identification and humidity monitoring applications. The tag consists of two planar inductor-capacitor resonators operating wirelessly through inductive coupling. One resonator is used to encode ID data based on frequency spectrum signature, and another one works as a humidity sensor, utilizing a paper substrate as a sensing material. The sensing performances of three paper substrates, including commercial packaging paper, are investigated. The use of paper provides excellent sensitivity and reasonable response time to humidity. The cheap and robust packaging paper, particularly, exhibits the largest sensitivity over the relative humidity range from 20% to 70%, which offers the possibility of directly printing the sensor tag on traditional packages to make the package intelligent at ultralow cost.

Keywords
Humidity sensor, chipless RFID, printed sensor, LC resonator
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-159642 (URN)10.1109/JSEN.2014.2385154 (DOI)000353149800004 ()2-s2.0-84928266964 (Scopus ID)
Funder
VINNOVA
Note

QC 20150805. Updated from accepted to published.

Available from: 2015-02-05 Created: 2015-02-05 Last updated: 2017-12-05Bibliographically approved
Xie, L., Feng, Y., Yang, G., Chen, Q. & Zheng, L.-R. (2015). RF Interconnections for Paper Electronics. IEEE Microwave and Wireless Components Letters, 25(10), 684-686
Open this publication in new window or tab >>RF Interconnections for Paper Electronics
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2015 (English)In: IEEE Microwave and Wireless Components Letters, ISSN 1531-1309, E-ISSN 1558-1764, Vol. 25, no 10, p. 684-686Article in journal (Refereed) Published
Abstract [en]

Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.

Keywords
Capacitive coupling, inkjet printing, paper electronics, RF interconnection
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-175916 (URN)10.1109/LMWC.2015.2468572 (DOI)000362359100018 ()2-s2.0-84961054007 (Scopus ID)
Funder
VINNOVA
Note

QC 20151104

Available from: 2015-11-04 Created: 2015-10-26 Last updated: 2017-12-01Bibliographically approved
Yang, G., Xie, L., Mantysalo, M., Zhou, X., Pang, Z., Xu, L. D., . . . Zheng, L.-R. (2014). A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box. IEEE Transactions on Industrial Informatics, 10(4), 2180-2191
Open this publication in new window or tab >>A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box
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2014 (English)In: IEEE Transactions on Industrial Informatics, ISSN 1551-3203, E-ISSN 1941-0050, Vol. 10, no 4, p. 2180-2191Article in journal (Refereed) Published
Abstract [en]

In-home healthcare services based on the Internet-of-Things (IoT) have great business potential; however, a comprehensive platform is still missing. In this paper, an intelligent home-based platform, the iHome Health-IoT, is proposed and implemented. In particular, the platform involves an open-platform-based intelligent medicine box (iMedBox) with enhanced connectivity and interchangeability for the integration of devices and services; intelligent pharmaceutical packaging (iMedPack) with communication capability enabled by passive radio-frequency identification (RFID) and actuation capability enabled by functional materials; and a flexible and wearable bio-medical sensor device (Bio-Patch) enabled by the state-of-the-art inkjet printing technology and system-on-chip. The proposed platform seamlessly fuses IoT devices (e. g., wearable sensors and intelligent medicine packages) with in-home healthcare services (e. g., telemedicine) for an improved user experience and service efficiency. The feasibility of the implemented iHome Health-IoT platform has been proven in field trials.

Keywords
Bio-Patch, Health-IoT, intelligent medicine box (iMedBox), intelligent packaging, Internet-of-Things (IoT), printed electronics
National Category
Control Engineering
Identifiers
urn:nbn:se:kth:diva-158417 (URN)10.1109/TII.2014.2307795 (DOI)000344995800020 ()2-s2.0-84908636513 (Scopus ID)
Note

QC 20150107

Available from: 2015-01-07 Created: 2015-01-07 Last updated: 2017-12-05Bibliographically approved
Xie, L. (2014). Heterogeneous Integration of Silicon and Printed Electronics for Intelligente Sensing Devices. (Doctoral dissertation). Stockholm: KTH Royal Institute of Technology
Open this publication in new window or tab >>Heterogeneous Integration of Silicon and Printed Electronics for Intelligente Sensing Devices
2014 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Driven by the exploding popularity of the Internet-of-Things (IoT), the demand for thin, flexible, lightweight intelligent sensingdevices is growing rapidly. Two attractive examples are intelligent packaging and wearable healthcare monitoring devices, which help to connect and track / monitor everything / everybody at any time and in any place. The remarkably swift development of flexible and printed electronics is promoting new possibilities for cost-effective manufacturing of such devices. However, compared with silicon-based circuits, state-of-the-art all-printed circuits are encountering low integration density, long switching time and corresponding high cost per function. Therefore, a heterogeneous platform is in great demand, which employs a cost-effective, large-area manufacturing technique while keeping the same complex functionality and processing capability as silicon-based systems. Due to temperature and mechanical reasons, traditional silicon integration methods, such as solder bonding and wire bonding, are not suitable for flexible printed electronics. This thesis aims to develop a generally applicable hetero-geneous integration platform for the realization of intelligent sensing devices on flexible substrates.

First, inkjet printing technique is introduced and studied. As the basic and key element, inkjet printing technology is employed to fabricate interconnections as well as electrodes of the printed sensors. Novel flexible media, plastic and paper, are evaluated as the substrates of printed electronic systems from two aspects: the electrical characteristics and performance reliability. In addition to widely used inkjet/photo paper, packaging paper is presented as a promising candidate for intelligent packaging applications due to the advantages in terms of lower price, higher temperature endurance and better reliability against 85◦/85% RH aging.

Second, the heterogeneous integration platform enabled byinkjet printing is presented. Benefiting from the non-contact, accurate alignment and fine resolution features, this integration technique has the advantages of simplified fabrication process and multi-substrate compatibility. The design rules have been studied and the integration process is optimized for silicon chips with/without packaging.

Finally, to verify the suitability, the heterogeneous integration platform is applied to two representative applications, each with unique emphasis and requirements.

For intelligent packaging, low-cost is one crucial requirement. Paper substrate is selected because it is cost-effective, recyclableand a commonly-used packaging material in industry. In order to fit into non-regular shape pack-ages, the intelligent packaging needs to be bent or folded, which brings about reliability concern for paper electronics. Therefore, bending and folding tests are applied to reveal the capability and the limitation of paper electronics in terms of flexibility. For applications such as fresh food tracking, humidity is an important physical quantity to monitor during transportation and storage. Therefore, a resistive humidity sensor based on multi-walled carbon nanotubes is fabricated and integrated. A commercial packaged microcontroller is used to sense and store the resistance of the sensor and control the LEDs to indicate the ambient humidity level. By integratingthe microcon-troller, LEDs and a switch with the printed sensor and battery, a prototype of a paper-based humidity sensor card is implemented.

For the healthcare application, user comfort is an essential element. Future long-term healthcare devices require a bio-sensing system which is small, thin, lightweight and wearable, has a long-battery life, and is easy to customize. The heterogeneous platform offers a promising solution for such systems from three aspects. 1) A fully integrated system-on-chip (SoC) is embedded to detect and process the bio-signal. The SoC solution features tiny size and low-power consumption, which contribute to system miniaturization and long battery lifetime. 2) Inkjet printing offers a cost-effective approach to fabricate personalized electrodes. 3) Inkjet printed interconnections enable the direct integration of the bare die instead of the packaged chip. This significantly reduces the physical size of the system, simplifies the manufacture process and lowers the cost. The concept is demonstrated by aminiaturized wearable Bio-Patch with the size of 4.5 cm×2.5 cm.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2014. p. v, 61
Series
TRITA-ICT-ECS AVH, ISSN 1653-6363 ; 14:05
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-142920 (URN)978-91-7595-033-4 (ISBN)
Public defence
2014-03-28, Sal/Hall D, KTH-ICT, Isafjordsgatan 39, Kista, 10:00 (English)
Opponent
Supervisors
Note

QC 20140314

Available from: 2014-03-14 Created: 2014-03-13 Last updated: 2014-03-14Bibliographically approved
Yang, G., Chen, J., Xie, L., Mao, J., Tenhunen, H. & Zheng, L.-R. (2013). A Hybrid Low Power Biopatch for Body Surface Potential Measurement. IEEE Journal of Biomedical and Health Informatics, 17(3), 591-599
Open this publication in new window or tab >>A Hybrid Low Power Biopatch for Body Surface Potential Measurement
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2013 (English)In: IEEE Journal of Biomedical and Health Informatics, ISSN 2168-2194, Vol. 17, no 3, p. 591-599Article in journal (Refereed) Published
Abstract [en]

This paper presents a wearable biopatch prototype for body surface potential measurement. It combines three key technologies, including mixed-signal system on chip (SoC) technology, inkjet printing technology, and anisotropic conductive adhesive (ACA) bonding technology. An integral part of the biopatch is a low-power low-noise SoC. The SoC contains a tunable analog front end, a successive approximation register analog-to-digital converter, and a reconfigurable digital controller. The electrodes, interconnections, and interposer are implemented by inkjet-printing the silver ink precisely on a flexible substrate. The reliability of printed traces is evaluated by static bending tests. ACA is used to attach the SoC to the printed structures and form the flexible hybrid system. The biopatch prototype is light and thin with a physical size of 16 cm x 16 cm. Measurement results show that low-noise concurrent electrocardiogram signals from eight chest points have been successfully recorded using the implemented biopatch.

Place, publisher, year, edition, pages
IEEE Computer Society, 2013
Keywords
body surface potential, Active Cable, inkjet printing, ACA, wearable device, SoC, Bio-Patch
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - ICT
Identifiers
urn:nbn:se:kth:diva-119278 (URN)10.1109/JBHI.2013.2252017 (DOI)000321146100011 ()24592461 (PubMedID)2-s2.0-84885120353 (Scopus ID)
Funder
Vinnova
Note

QC 20130805. Updated from accepted to published.

Available from: 2013-03-18 Created: 2013-03-11 Last updated: 2020-03-09Bibliographically approved
Shen, J., Xie, L., Mao, J. & Zheng, L. (2013). A Passive UHF-RFID Tag with Inkjet-Printed Electrochromic Paper Display. In: Proceedings of the IEEE International Conference on RFID (RFID), 2013: . Paper presented at 2013 IEEE International Conference on RFID, RFID 2013; Orlando, FL; United States; 30 April 2013 through 2 May 2013 (pp. 118-123). IEEE conference proceedings
Open this publication in new window or tab >>A Passive UHF-RFID Tag with Inkjet-Printed Electrochromic Paper Display
2013 (English)In: Proceedings of the IEEE International Conference on RFID (RFID), 2013, IEEE conference proceedings, 2013, p. 118-123Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, an inkjet-printed electrochromic(EC) paper display integrated with passive UHF-RFID tag is introduced as a solution for passive electronic shelf labels (ESL). To address the system challenges of the limited power budget of passive UHF-RFID tags and the material aging of EC display, a feedback comparator integrated digital displaydriver is proposed based on the study of electrochromic, bi-stable and aging features of the EC display. Modularized baseband with different enableconditions and clock domains is implemented in the system design level. Moreover, to maintain the system functions when the input power is lower than the display refresh power, a duty-cycled power management unit (PMU) is activated to reduce the load current during energy scavenging and drive the display in short intervals, enabling the fast charging of the voltage rectifier and the correct output of the regulated supply for the core circuit. The design is fabricated in a 0.18-um CMOS process with an area of 2.25 mm2. Fed with EPC C1G2 protocol write command, experiments demonstrate correct refresh of EC display with 4 cm2 effective area. System sensitivity at the antenna reference point is basically immune to the display load. Further improvements can be achieved after careful chip-to-antenna impedance matching and PMU efficiency optimization.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2013
Keywords
electrochromic display, bi-stability, aging, passive UHF-RFID, feedback comparator, duty-cycled power management
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-123405 (URN)10.1109/RFID.2013.6548144 (DOI)000326738900017 ()2-s2.0-84881359034 (Scopus ID)978-1-4673-5749-4 (ISBN)978-1-4673-5748-7 (ISBN)
Conference
2013 IEEE International Conference on RFID, RFID 2013; Orlando, FL; United States; 30 April 2013 through 2 May 2013
Note

Qc 20130718

Available from: 2013-06-08 Created: 2013-06-08 Last updated: 2015-10-12Bibliographically approved
Xie, L., Yang, G., Xu, L., Seoane, F., Chen, Q. & Zheng, L. (2013). Characterization of dry biopotential electrodes. In: Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS: . Paper presented at 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2013; Osaka, Japan, 3-7 July 2013 (pp. 1478-1481).
Open this publication in new window or tab >>Characterization of dry biopotential electrodes
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2013 (English)In: Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, 2013, p. 1478-1481Conference paper, Published paper (Refereed)
Abstract [en]

Driven by the increased interest in wearable long-term healthcare monitoring systems, varieties of dry electrodes are proposed based on different materials with different patterns and structures. Most of the studies reported in the literature focus on proposing new electrodes and comparing its performance with commercial electrodes. Few papers are about detailed comparison among different dry electrodes. In this paper, printed metal-plate electrodes, textile based electrodes, and spiked electrodes are for the first time evaluated and compared under the same experimental setup. The contact impedance and noise characterization are measured. The in-vivo electrocardiogram (ECG) measurement is applied to evaluate the overall performance of different electrodes. Textile electrodes and printed electrodes gain comparable high-quality ECG signals. The ECG signal obtained by spiked electrodes is noisier. However, a clear ECG envelope can be observed and the signal quality can be easily improved by backend signal processing. The features of each type of electrodes are analyzed and the suitable application scenario is addressed.

Series
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, ISSN 1557-170X
Keywords
Application scenario, Biopotential electrodes, Contact impedance, Healthcare monitoring, Noise characterization, Printed electrodes, Signal quality, Textile electrodes, Electrocardiography, Plate metal, Signal processing, Textiles, Electrodes
National Category
Medical Engineering
Identifiers
urn:nbn:se:kth:diva-140001 (URN)10.1109/EMBC.2013.6609791 (DOI)000341702101241 ()24109978 (PubMedID)2-s2.0-84886466999 (Scopus ID)9781457702167 (ISBN)
Conference
2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2013; Osaka, Japan, 3-7 July 2013
Note

QC 20140117

Available from: 2014-01-17 Created: 2014-01-16 Last updated: 2020-03-09Bibliographically approved
Feng, Y., Xie, L., Mäntysalo, M., Chen, Q. & Zheng, L.-R. (2013). Electrical and humidity-sensing characterization of inkjet-printed multi-walled carbon nanotubes for smart packaging. In: IEEE SENSORS 2013 - Proceedings: . Paper presented at 12th IEEE SENSORS 2013 Conference; Baltimore, MD; United States; 4 November 2013 through 6 November 2013 (pp. 1-4). IEEE
Open this publication in new window or tab >>Electrical and humidity-sensing characterization of inkjet-printed multi-walled carbon nanotubes for smart packaging
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2013 (English)In: IEEE SENSORS 2013 - Proceedings, IEEE , 2013, p. 1-4Conference paper, Published paper (Refereed)
Abstract [en]

Printing is considered a cost-effective way to fabricate electronics on unconventional substrates enabling, for example, smart packaging. Functionalized multi-walled carbon nanotubes (f-MWCNTs) having carboxylic groups on their surfaces possess great potential as flexible resistive humidity sensor. In this paper, we report on the inkjet printing and characterization of f-MWCNTs in terms of sheet resistance and humidity-sensitivity. Stable f-MWCNTs ink is formulated using aqueous ethylene glycol as solvent. Sheet resistance of printed f-MWCNTs films on polyimide foil reduces by increasing the number of printed layers as well as post-printing annealing temperature. Meanwhile, the raised annealing temperature degrades the films' humidity-sensitivity, which could be explained by the loss of the carboxylic groups. The electrical and sensing properties of f-MWCNTs also have a negative temperature coefficient regarding ambient temperature, which should be considered in practical application.

Place, publisher, year, edition, pages
IEEE, 2013
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-134222 (URN)10.1109/ICSENS.2013.6688306 (DOI)000379846100169 ()2-s2.0-84893924602 (Scopus ID)978-1-4673-4640-5 (ISBN)
Conference
12th IEEE SENSORS 2013 Conference; Baltimore, MD; United States; 4 November 2013 through 6 November 2013
Projects
iPack Vinnova CenterEuropean FP7 CLIP
Funder
Vinnova
Note

QC 20140207

Available from: 2013-11-20 Created: 2013-11-20 Last updated: 2020-03-05Bibliographically approved
Organisations
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0002-0528-9371

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