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Interconnection challenges on integrated terahertz photonic systems
Univ Carlos III Madrid, Av Univ 30, Madrid 28911, Spain..
Univ Carlos III Madrid, Av Univ 30, Madrid 28911, Spain..
Univ Carlos III Madrid, Av Univ 30, Madrid 28911, Spain..
Univ Carlos III Madrid, Av Univ 30, Madrid 28911, Spain..
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2021 (English)In: OPTICAL INTERCONNECTS XXI / [ed] Schroder, H Chen, RT, SPIE-Intl Soc Optical Eng , 2021, article id 116920NConference paper, Published paper (Refereed)
Abstract [en]

We present the current challenges for high frequency interconnects, especially for calibrated measures of the frequency response of components operating above 100 GHz. This is the challenge addressed by the TERAmeasure Future and Emerging Technologies project, aiming to combine photonics and electronics to develop new paradigm in the millimetre and Terahertz frequency ranges, overcoming the current obstacles to better measurements, eliminating the frequency banded nature of rectangular waveguides and providing metrology-grade results across the full frequency range.

Place, publisher, year, edition, pages
SPIE-Intl Soc Optical Eng , 2021. article id 116920N
Series
Proceedings of SPIE, ISSN 0277-786X ; 11692
Keywords [en]
Terahertz interconnects, Terahertz probes, Ultra-wideband, Vector Network Analyzer
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-299166DOI: 10.1117/12.2582982ISI: 000672829300011Scopus ID: 2-s2.0-85105955443OAI: oai:DiVA.org:kth-299166DiVA, id: diva2:1582907
Conference
Conference on Optical Interconnects XXI, MAR 06-11, 2021, ELECTR NETWORK
Note

QC 20210804

Available from: 2021-08-04 Created: 2021-08-04 Last updated: 2022-06-25Bibliographically approved

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Lioubtchenko, DmitriXenidis, Nikolaos

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Citation style
  • apa
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  • de-DE
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  • fi-FI
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Output format
  • html
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