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Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range
Univ Carlos III Madrid, Dept Teoria Senal & Comunicac, Leganes 28911, Spain.;Yebes Observ, Inst Geog Nacl, Direcc Gen, Yebes 19141, Spain..
Univ Carlos III Madrid, Dept Tecnol Elect, Madrid 28911, Spain..
Univ Carlos III Madrid, Dept Tecnol Elect, Madrid 28911, Spain..
Univ Carlos III Madrid, Dept Teoria Senal & Comunicac, Madrid 28911, Spain..
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2023 (English)In: IEEE Transactions on Terahertz Science and Technology, ISSN 2156-342X, E-ISSN 2156-3446, Vol. 13, no 1, p. 34-43Article in journal (Refereed) Published
Abstract [en]

Radiofrequency (RF) probes based on 50-omega planar transmission lines play a key role in almost every stage of RF device development, establishing the physical contact between high-end instrumentation and the device. With the continuous downscaling of semiconductor technologies to reach into the millimeter-wave (30-300 GHz) and Terahertz (300 GHz to 3 THz) bands and devices exhibiting broader frequency response, current RF probe technology is the Achilles heel for precise and repeatable measurements. Here, we propose a novel RF probe technology based on the near-field coupling of single-mode dielectric waveguide structures, which according to our full-wave simulations provide an extremely broad frequency range covering from 0 Hz up to 340 GHz, the largest continuous bandwidth reported to date. A concept demonstrator using this approach shows contactless RF probing on test structures, which shows the path toward continuous measurements across the microwave, millimeter-wave, and Terahertz range.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2023. Vol. 13, no 1, p. 34-43
Keywords [en]
Probes, Radio frequency, Dielectrics, Dielectric measurement, Connectors, Optical waveguides, Rectangular waveguides, Contactless probe, dielectric rod waveguide (DRW), terahertz, ultra-wideband interconnection
National Category
Electrical Engineering, Electronic Engineering, Information Engineering Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-324484DOI: 10.1109/TTHZ.2022.3213470ISI: 000920767700006Scopus ID: 2-s2.0-85139876835OAI: oai:DiVA.org:kth-324484DiVA, id: diva2:1743304
Note

QC 20230314

Available from: 2023-03-14 Created: 2023-03-14 Last updated: 2023-03-14Bibliographically approved

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Lioubtchenko, Dmitri

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