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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip
KTH, Skolan för elektro- och systemteknik (EES), Elkraftteknik. Swerea KIMAB, Sweden.
KTH, Skolan för elektro- och systemteknik (EES), Elkraftteknik. Swerea KIMAB, Sweden.ORCID-id: 0000-0001-5731-7859
KTH, Skolan för elektro- och systemteknik (EES), Elkraftteknik.ORCID-id: 0000-0002-1755-1365
Vise andre og tillknytning
2017 (engelsk)Inngår i: 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Institute of Electrical and Electronics Engineers (IEEE), 2017, artikkel-id 7936753Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

sted, utgiver, år, opplag, sider
Institute of Electrical and Electronics Engineers (IEEE), 2017. artikkel-id 7936753
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Identifikatorer
URN: urn:nbn:se:kth:diva-210878DOI: 10.1109/IWIPP.2017.7936753Scopus ID: 2-s2.0-85025660047ISBN: 9781509042784 (tryckt)OAI: oai:DiVA.org:kth-210878DiVA, id: diva2:1120625
Konferanse
2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Delft, Netherlands, 5 April 2017 through 7 April 2017
Merknad

QC 20170803

Tilgjengelig fra: 2017-07-06 Laget: 2017-07-06 Sist oppdatert: 2017-08-03bibliografisk kontrollert

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