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MEMS single-chip 5x5 and 20x20 double-switch arrays for telecommunication networks
KTH, Skolan för elektro- och systemteknik (EES), Mikrosystemteknik (Bytt namn 20121201).
KTH, Skolan för elektro- och systemteknik (EES), Mikrosystemteknik (Bytt namn 20121201).
KTH, Skolan för elektro- och systemteknik (EES), Mikrosystemteknik (Bytt namn 20121201).ORCID-id: 0000-0001-9552-4234
2007 (engelsk)Inngår i: IEEE 20th International Conference on Micro Electro Mechanical Systems, 2007. MEMS, New York: IEEE , 2007, s. 811-814Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

This paper reports on a microelectromechanical switch array with up to 20x20 double switches and packaged on a single chip and utilized for main distribution frames in copper-wire networks. The device includes 5x5 or 20x20 allowing for an any-to-any interconnection of the input line to the specific output line. The switches are on an electrostatic S-shaped film actuator with the contact moving between a top and a bottom electrode. device is fabricated in two parts and is designed to assembled using selective adhesive wafer bonding in a wafer-scale package of the switch array. The 5x5 switch arrays have a size of 6.7x6.4mm(2) and the arrays are 14x10 mm(2) large. The switch actuation for closing/opening the switches averaged over an array measured to be 21.2 V / 15.3 V for the 5x5 array 93.2 V / 37.3 V for the 20x20 array. The total impedance varies on the 5x5 array between 0.126 Omega 0.564 Omega at a measurement current of 1 mA. The resistance of the switch contacts within the 5x5 array determined to be 0.216 Omega with a standard deviation 0. 155 Omega.

sted, utgiver, år, opplag, sider
New York: IEEE , 2007. s. 811-814
Serie
Proceedings: IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
Emneord [en]
Composite micromechanics, Copper, Electrostatic actuators, Mechanical engineering, Mechanics, Mechatronics, MEMS, Microelectromechanical devices, Optical design, Reactive ion etching, Switching circuits, Telecommunication networks, Telecommunication systems, Wafer bonding
HSV kategori
Identifikatorer
URN: urn:nbn:se:kth:diva-13780DOI: 10.1109/MEMSYS.2007.4433176ISI: 000255867800217Scopus ID: 2-s2.0-50049130020ISBN: 978-142440951-8 ISBN: 1424409519 (tryckt)OAI: oai:DiVA.org:kth-13780DiVA, id: diva2:327249
Konferanse
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) Kobe, Japan, January 21-25, 2007
Merknad

QC 20141208

Tilgjengelig fra: 2010-06-28 Laget: 2010-06-28 Sist oppdatert: 2018-01-12bibliografisk kontrollert

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