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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.
Mycronic AB, S-18353 Taby, Sweden..
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2018 (English)In: IEEE Access, E-ISSN 2169-3536, Vol. 6, p. 44306-44317Article in journal (Refereed) Published
Abstract [en]

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018. Vol. 6, p. 44306-44317
Keywords [en]
Chip scale packaging, femtosecond laser, glass interposer, laser ablation, multichip modules, robotic assembly, self-assembly, spin-on glass, thermal expansion, through-glass via, through-silicon vias, TSV
National Category
Communication Systems
Identifiers
URN: urn:nbn:se:kth:diva-235465DOI: 10.1109/ACCESS.2018.2861886ISI: 000444505800001Scopus ID: 2-s2.0-85050982480OAI: oai:DiVA.org:kth-235465DiVA, id: diva2:1251860
Funder
Knut and Alice Wallenberg FoundationVINNOVA, 324189Swedish Foundation for Strategic Research , GMT14-0071 RIF14-0017
Note

QC 20180928

Available from: 2018-09-28 Created: 2018-09-28 Last updated: 2018-10-02Bibliographically approved

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Bleiker, Simon J.Asiatici, MikhailFischer, Andreas C.Stemme, GöranNiklaus, Frank

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Laakso, Miku J.Bleiker, Simon J.Liljeholm, JessicaAsiatici, MikhailFischer, Andreas C.Stemme, GöranNiklaus, Frank
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