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Through-Glass Vias for MEMS Packaging
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0003-1112-3308
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems. Silex Microsystems AB.
Mycronic AB.
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2018 (English)Conference paper, Oral presentation with published abstract (Other academic)
Abstract [en]

Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs). The method allows rapid filling of via holes with metal rods both in thin and thick glass substrates.

Background Vertical electrical feedthroughs in glass substrates, i.e. TGVs, are often required in wafer-scale packaging of MEMS that utilizes glass lids. The current methods of making TGVs have drawbacks that prevent the full utilization of the excellent properties of glass as a package material, e.g. low RF losses. Magnetic assembly has been used earlier to fabricate through-silicon vias (TSVs), and in this work we extend this method to realize TGVs [1].

Methods The entire TGV fabrication process is maskless, and the processes used include: direct patterning of wafer metallization using femtosecond laser ablation, magnetic-fieldassisted self-assembly of metal wires into via holes, and solder-paste jetting of bump bonds on TGVs.

Results We demonstrate that: (1) the magnetically assembled TGVs have a low resistance, which makes them suitable even for low-loss and high-current applications; (2) the magneticassembly process can be parallelized in order to increase the wafer-scale fabrication speed; (3) the magnetic assembly produces void-free metal filling for TGVs, which allows solder placement directly on top of the TGV for the purpose of high integration density; and (4) good thermal-expansion compatibility between TGV metals and glass substrates is possible with the right choice of materials, and several suitable metals-glass pairs are identified for possible improvement of package reliability [2].

[1] M. Laakso et al., IEEE 30th Int. Conf. on MEMS, 2017. DOI:10.1109/MEMSYS.2017.7863517

[2] M. Laakso et al., “Through-Glass Vias for Glass Interposers and MEMS Packaging Utilizing Magnetic Assembly of Microscale Metal Wires,” manuscript in preparatio

Place, publisher, year, edition, pages
2018.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-238647OAI: oai:DiVA.org:kth-238647DiVA, id: diva2:1261110
Conference
The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May
Note

QC 20181106

Available from: 2018-11-06 Created: 2018-11-06 Last updated: 2019-05-17Bibliographically approved

Open Access in DiVA

fulltext(587 kB)47 downloads
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File name FULLTEXT01.pdfFile size 587 kBChecksum SHA-512
187953a5105ac4e3798e794c71da7182d134de16bf06a7910cb8316dfde8a466034db09a78e313e790093aff87dc66aeef82ef8798767cc0254cadee4889fc2e
Type fulltextMimetype application/pdf

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Conference abstractshttps://msw2018.aalto.fi/msw/

Authority records BETA

Laakso, MikuBleiker, Simon J.Asiatici, MikhailFischer, Andreas C.Stemme, GöranNiklaus, Frank

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Laakso, MikuBleiker, Simon J.Liljeholm, JessicaAsiatici, MikhailFischer, Andreas C.Stemme, GöranNiklaus, Frank
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Micro and Nanosystems
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