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The Role of Glide during Creep of Copper at Low Temperatures
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.ORCID iD: 0000-0001-5059-1791
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Materials Technology.ORCID iD: 0000-0002-8494-3983
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.ORCID iD: 0000-0002-9920-5393
2018 (English)In: METALS, ISSN 2075-4701, Vol. 8, no 10, article id 772Article in journal (Refereed) Published
Abstract [en]

Copper canister will be used in Scandinavia for final storage of spent nuclear fuel. The copper will be exposed to temperatures of up to 100 degrees C. The creep mechanism at near ambient temperatures has been assumed to be glide of dislocations, but this has never been verified for copper or other materials. In particular, no feasible mechanism for glide based static recovery has been proposed. To attack this classical problem, a glide mobility based on the assumption that it is controlled by the climb of the jogs on the dislocations is derived and shown that it is in agreement with observations. With dislocation dynamics (DD) simulations taking glide but not climb into account, it is demonstrated that creep based on glide alone can reach a quasi-stationary condition. This verifies that static recovery can occur just by glide. The DD simulations also show that the internal stress during creep in the loading direction is almost identical to the applied stress also directly after a load drop, which resolves further classical issues.

Place, publisher, year, edition, pages
MDPI, 2018. Vol. 8, no 10, article id 772
Keywords [en]
creep, dislocation dynamics, glide, internal stress
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-239112DOI: 10.3390/met8100772ISI: 000448658700036Scopus ID: 2-s2.0-85054663275OAI: oai:DiVA.org:kth-239112DiVA, id: diva2:1264546
Note

QC 20181120

Available from: 2018-11-20 Created: 2018-11-20 Last updated: 2019-08-20Bibliographically approved

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Delandar, Arash HosseinzadehSandström, RolfKorzhavyi, Pavel A.

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