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Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-2752-7422
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-7339-6662
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-3325-8273
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2022 (English)Conference paper, Published paper (Other academic)
Abstract [en]

The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic devices such as integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic MEMS have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin Si caps.

Place, publisher, year, edition, pages
2022.
Keywords [en]
Si photonics, MEMS, Hermetic sealing, Wafer-level vacuum packaging
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-322074OAI: oai:DiVA.org:kth-322074DiVA, id: diva2:1714873
Conference
WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, October 5-6, 2022.
Projects
MORPHIC (EU, H2020)ZeroAMP (EU, H2020)ULISSES (EU, H2020)AEOLUS (EU, H2020)
Funder
EU, Horizon 2020, 780283EU, Horizon 2020, 871740EU, Horizon 2020, 825272EU, Horizon 2020, 101017186
Note

QC 20221214

Available from: 2022-11-30 Created: 2022-11-30 Last updated: 2022-12-14Bibliographically approved

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Jo, GaehunEdinger, PierreBleiker, Simon J.Wang, XiaojingStemme, GöranGylfason, KristinnNiklaus, Frank

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CiteExportLink to record
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Citation style
  • apa
  • ieee
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Output format
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