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Making Biomaterials for Sustainable Tangible Interfaces
Department of Computer Science, University of New Mexico, Albuquerque, New Mexico, USA.
School of Information Technology, Carleton University, Ottawa, Ontario, Canada.
KTH, School of Electrical Engineering and Computer Science (EECS), Human Centered Technology, Media Technology and Interaction Design, MID.ORCID iD: 0000-0002-7673-0822
ATLAS Institute, University of Colorado Boulder, Boulder, Colorado, USA.
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2024 (English)In: TEI 2024 - Proceedings of the 18th International Conference on Tangible, Embedded, and Embodied Interaction, Association for Computing Machinery (ACM) , 2024, article id 55Conference paper, Published paper (Refereed)
Abstract [en]

In this studio, we will explore sustainable tangible interfaces by making a range of biomaterials that are bio-based and readily biodegradable. Building off of previous TEI studios that were centered around one specific biomaterial (i.e., bioplastics at TEI'22 and microbial cellulose at TEI'23), this studio will provide participants the ability to experience a wide variety of biomaterials from algae-based bioplastics, to food-waste-based bioclays, to gelatin-based biofoams. We will teach participants how to identify types of biomaterials that are applicable to their own research and how to make them. Through hands-on activities, we will demonstrate how to implement biomaterials in the design of sustainable tangible interfaces and discuss topics sensitized by biological media such as more-than-human temporalities, bioethics, care, and unmaking. Ultimately, our goal is to facilitate a space in which HCI researchers and designers can collaborate, create, and discuss the opportunities and challenges of working with sustainable biomaterials.

Place, publisher, year, edition, pages
Association for Computing Machinery (ACM) , 2024. article id 55
Keywords [en]
Bio-HCI, Biodesign, Biomaterials, DIYBio, Materiality, More-Than-Human Design, Sustainability, Tangible Interfaces
National Category
Design
Identifiers
URN: urn:nbn:se:kth:diva-344034DOI: 10.1145/3623509.3634740Scopus ID: 2-s2.0-85185217705OAI: oai:DiVA.org:kth-344034DiVA, id: diva2:1841404
Conference
18th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2024, Cork, Ireland, Feb 11 2024 - Feb 14 2024
Note

QC 20240229

Part of ISBN; 9798400704024

Available from: 2024-02-28 Created: 2024-02-28 Last updated: 2024-02-29Bibliographically approved

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  • apa
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