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Pipeline-based interlayer bus structure for 3D networks-on-chip
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2010 (English)In: Proceedings - 15th CSI International Symposium on Computer Architecture and Digital Systems, CADS 2010, 2010, p. 35-41, article id 5623524Conference paper, Published paper (Refereed)
Abstract [en]

The structure of direct vertical interconnections, called Through Silicon Vias (TSVs), is an important issue in the realm of 3D ICs. The bus-based and network-based structures are the two dominant architectures for implementing TSVs as interlayer connection in 3D ICs. Both implementations have some disadvantages. The former suffers from poor scalability and deteriorates the performance at high injection rates, and the latter consumes more area and power dissipation. In this paper, we propose a novel pipeline bus structure for TSVs to improve the performance of the prior bus-based architecture. The presented structure can utilize bi-synchronous FIFO for synchronization between stacked layers if each layer is fabricated by different technologies. Experimental results with synthetic test cases demonstrate that the proposed architecture gives significant improvements in average network latency. Also, the hardware area and power consumption of the presented bus structure are 9% and 11% less than the typical bus structure of TSVs, respectively.

Place, publisher, year, edition, pages
2010. p. 35-41, article id 5623524
Keywords [en]
3-D ICs, 3D networks, Bi-synchronous FIFO, Bus structures, Bus-based, High injection, Network latencies, Network-based, Power Consumption, Power dissipation, Proposed architectures, Stacked layer, Synthetic tests, Through silicon vias, Vertical interconnections
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-73466DOI: 10.1109/CADS.2010.5623524Scopus ID: 2-s2.0-78650140220OAI: oai:DiVA.org:kth-73466DiVA, id: diva2:488961
Conference
15th Computer Society of Iran (CSI) Symposium on Computer Architecture and Digital Systems, CADS 2010. Tehran. 23 September 2010 - 24 September 2010
Note

Part of proceedings:ISBN 978-142446269-8

QC 20120208

Available from: 2012-02-02 Created: 2012-02-02 Last updated: 2024-03-18Bibliographically approved

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Tenhunen, Hannu

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CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf