High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.