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Reliability Analysis of Interconnects at Edge Tier in Datacenters
KTH, School of Information and Communication Technology (ICT), Communication Systems, CoS, Optical Network Laboratory (ON Lab).
KTH, School of Information and Communication Technology (ICT), Communication Systems, CoS, Optical Network Laboratory (ON Lab).ORCID iD: 0000-0002-5318-2050
KTH, School of Information and Communication Technology (ICT), Communication Systems, CoS, Optical Network Laboratory (ON Lab).ORCID iD: 0000-0001-6704-6554
KTH, School of Information and Communication Technology (ICT), Communication Systems, CoS, Optical Network Laboratory (ON Lab).ORCID iD: 0000-0002-6989-9048
2015 (English)In: 2015 17th International Conference on Transparent Optical Networks (ICTON), Institute of Electrical and Electronics Engineers (IEEE), 2015, article id UNSP We.C3.1Conference paper, Published paper (Refereed)
Abstract [en]

The growing popularity of cloud based applications is drastically increasing the traffic volume that datacenters have to handle. This brings the need for scalable, reliable, and energy-efficient interconnection networks inside the datacenters. Optical communication has been considered as a promising technology for datacenter applications due to its high energy- and cost-efficiency at ultra-high capacity. A typical datacenter interconnection network includes several tiers. Figure 1 shows an example with three tiers: edge, aggregation and core. Due to the large number of active devices on top of the rack (ToR) energy consumption at the edge tier is dominating the overall power consumed by all the switches within the datacenter [1-2]. Several passive optical interconnect approaches [2-4] have been proposed showing that replacing active optical devices by passive ones is possible to significantly reduce both the hardware cost and energy consumption, achieve lower maintenance complexity and offer a sufficient level of scalability. [GRAPHICS] Furthermore, several topologies, e.g., fat-tree [5], Quartz [6], are investigated in order to improve the resiliency and scalability, particularly for large-scale datacenters. However, it should be noted that the redundancy for these proposed topologies is often added in the aggregation and core tiers rather than the edge tier, due to the cost issue. Although passive optical ToR solution by nature could provide better reliability performance than its active counterpart, the intra-rack communication may still need survivability strategies to meet very high connection availability requirement. For instance, the required availability of fault-tolerant datacenter infrastructure (including electrical power supply, storage and distribution facilities) should be higher than 99.995% [7]. Then the expected availability for any connection established within the datacenter needs to be even higher, since the communication system is only a part of the site infrastructure. In this regard, we analyse reliability performance of optical interconnects and identify the key part to be protected. Based on it, we propose some reliable passive optical interconnects for the edge tier of the datacenter interconnection networks. They can achieve ultra-high connection availability for intra-rack communications and adapt to any topology, e.g., fat-tree and Quartz, designed to increase scalability and reliability performance for the overall datacenter network.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2015. article id UNSP We.C3.1
Series
International Conference on Transparent Optical Networks-ICTON, ISSN 2162-7339
Keywords [en]
datacentre networks, top of the rack, reliability, scalability
National Category
Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-191773ISI: 000380506700310ISBN: 978-1-4673-7880-2 (print)OAI: oai:DiVA.org:kth-191773DiVA, id: diva2:972678
Conference
17th International Conference on Transparent Optical Networks (ICTON 2015), JUL 05, 2015, Budapest, Hungary
Note

QC 20160922

Available from: 2016-09-22 Created: 2016-09-02 Last updated: 2024-03-15Bibliographically approved

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Cheng, YuxinFiorani, MatteoWosinska, LenaChen, Jiajia

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