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Modification of etched junction termination extension for the high voltage 4H-SiC power devices
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0002-7510-9639
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-8108-2631
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0002-5845-3032
2016 (English)In: Silicon Carbide and Related Materials, Trans Tech Publications, 2016, 978-981 p.Conference paper (Refereed)
Abstract [en]

High voltage 4H-SiC bipolar junction transistors (BJTs) with modified etched junction termination extension (JTE) were fabricated and optimized in terms of the length (LJTE) and remaining dose (DJTE) of JTEs. It is found that for a given total termination length (Σ LJTEi), a decremental JTE length from the innermost edge to the outermost mesa edge of the device will result in better modification of the electric field. A breakdown voltage (BV) of 4.95 kV is measured for the modified device which shows ~20% improvement of the termination efficiency for no extra cost or extra process step. Equal-size BJTs by interdigitated-emitter with different number of fingers and cell pitches were fabricated. The maximum current gain of 40 is achieved for a single finger device with the emitter width of 40 μm at IC = 0.25 A (JC = 310 A/cm2) which corresponds to RON = 33 mΩ.cm2. It is presented that the current gain decreases by having more fingers while the maximum current gain is achieved at higher current density.

Place, publisher, year, edition, pages
Trans Tech Publications, 2016. 978-981 p.
Series
Materials Science Forum, ISSN 0255-5476 ; 858
Keyword [en]
4H-SiC, BJT, Etched junction termination extension, High voltage
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-195395DOI: 10.4028/www.scientific.net/MSF.858.978ScopusID: 2-s2.0-84971515135ISBN: 978-303571042-7 (print)OAI: oai:DiVA.org:kth-195395DiVA: diva2:1046752
Conference
16th International Conference on Silicon Carbide and Related Materials, ICSCRM 2015, Sicily, Italy, 4 October 2015 through 9 October 2015
Note

QC 20161115

Available from: 2016-11-15 Created: 2016-11-03 Last updated: 2016-11-15Bibliographically approved

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Elahipanah, HosseinSalemi, ArashZetterling, Carl-MikaelÖstling, Mikael
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