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Passivated interconnect lines: Thermomechanical analysis and curvature measurements
KTH, Superseded Departments, Solid Mechanics.
KTH, Superseded Departments, Solid Mechanics.ORCID iD: 0000-0002-0307-8917
2000 (English)In: Materials Research Society Symposium - Proceedings, Materials Research Society, 2000, Vol. 594, 439-444 p.Conference paper, Published paper (Refereed)
Abstract [en]

It is well known that curvature measurements may be used to obtain volume averaged stresses in thin continuous films and unpassivated lines without knowledge of the material properties of the film or lines. However, recently a method was presented which makes it possible to use curvature measurements also for the determination of volume averaged stresses in passivated lines. Since the problem is statically indeterminate the method requires knowledge of the material properties of the lines and passivation. The sensitivity of the method to uncertainties in material properties and curvature data is here investigated by utilizing the finite element method for anisotropic Cu or Al lines embedded in SiO2 passivation. Furthermore, the method is extended to cover the case of different stress-free temperatures for the lines and passivation respectively.

Place, publisher, year, edition, pages
Materials Research Society, 2000. Vol. 594, 439-444 p.
Series
Materials Research Society Symposium - Proceedings, ISSN 0272-9172 ; 594
Keyword [en]
Aluminum, Copper, Finite element method, Passivation, Silica, Stress analysis, X ray diffraction analysis
National Category
Applied Mechanics
Research subject
Solid Mechanics
Identifiers
URN: urn:nbn:se:kth:diva-196746Scopus ID: 2-s2.0-0033652517OAI: oai:DiVA.org:kth-196746DiVA: diva2:1048255
Conference
Thin Films-Stress and Machanical Properties VIII, Boston, MA, USA, , 29 November 1999 through 3 December 1999
Note

QC 20161122

Available from: 2016-11-21 Created: 2016-11-21 Last updated: 2016-11-22Bibliographically approved

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