Investigation of pressure dependent thermal contact resistance between silver metallized SiC chip and molybdenum substrate and between molybdenum substrate and bulk copper
2016 (English)In: 16th International Conference on Silicon Carbide and Related Materials, ICSCRM 2015, Trans Tech Publications Ltd , 2016, 1061-1065 p.Conference paper (Refereed)
Thermal contact resistances between a silver metallized SiC chip and a Molybdenum substrate and between the Molybdenum substrate and bulk Copper were measured in a heat transfer experiment. An experimental method to separate thermal contact resistances in a multilayer heat transfer path was used to extract the layer-specific contact resistances. The experimental results were compared with theory based calculations and also with 3-D computational fluid dynamics (CFD) simulation results. The results show significant pressure dependence of the thermal contact resistance and the results show higher thermal contact resistance per unit area between the bulk SiC chip and Molybdenum than between Molybdenum and bulk Copper.
Place, publisher, year, edition, pages
Trans Tech Publications Ltd , 2016. 1061-1065 p.
DBC substrate, Heat transfer, Molybdenum substrate, Pressure dependence, SiC, Thermal contact resistance, Computation theory, Computational fluid dynamics, Contact resistance, Copper, Metallizing, Molybdenum, Silicon carbide, Silver, Substrates, Thermal conductivity of solids, Computational fluid dynamics simulations, Experimental methods, Per unit, Pressure dependent, Specific contact resistances, Heat resistance
IdentifiersURN: urn:nbn:se:kth:diva-195541DOI: 10.4028/www.scientific.net/MSF.858.1061ScopusID: 2-s2.0-84971578896ISBN: 9783035710427OAI: oai:DiVA.org:kth-195541DiVA: diva2:1048931
4 October 2015 through 9 October 2015
QC 201611222016-11-222016-11-032016-11-22Bibliographically approved