Promise of hybrid plasmonics for optical interconnects
2016 (English)In: International Conference on Transparent Optical Networks, IEEE Computer Society, 2016Conference paper (Refereed)
Optical interconnects is today an obvious solution for inter- and intra-data center communication, but is also continuously penetrating the shorter and shorter distances in structures down to chip-to-chip and on-chip data transfer for multi-core processors. © 2016 IEEE.
Place, publisher, year, edition, pages
IEEE Computer Society, 2016.
Data transfer, Fiber optic networks, Integrated circuit interconnects, Optical communication, Optical interconnects, Chip to chips, Data centers, Multi-core processor, Plasmonics, Transparent optical networks
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-194944DOI: 10.1109/ICTON.2016.7550265ScopusID: 2-s2.0-84985961640ISBN: 9781509014675OAI: oai:DiVA.org:kth-194944DiVA: diva2:1049292
18th International Conference on Transparent Optical Networks, ICTON 2016, 10 July 2016 through 14 July 2016
QC 201611242016-11-242016-11-012016-11-24Bibliographically approved