Change search
ReferencesLink to record
Permanent link

Direct link
Promise of hybrid plasmonics for optical interconnects
KTH, School of Information and Communication Technology (ICT), Materials- and Nano Physics, Fotonik och mikrovågsteknik, FMI.ORCID iD: 0000-0001-5967-2651
KTH, School of Information and Communication Technology (ICT), Materials- and Nano Physics, Optics and Photonics, OFO.ORCID iD: 0000-0003-3618-6049
2016 (English)In: International Conference on Transparent Optical Networks, IEEE Computer Society, 2016Conference paper (Refereed)
Abstract [en]

Optical interconnects is today an obvious solution for inter- and intra-data center communication, but is also continuously penetrating the shorter and shorter distances in structures down to chip-to-chip and on-chip data transfer for multi-core processors. © 2016 IEEE.

Place, publisher, year, edition, pages
IEEE Computer Society, 2016.
Keyword [en]
Data transfer, Fiber optic networks, Integrated circuit interconnects, Optical communication, Optical interconnects, Chip to chips, Data centers, Multi-core processor, Plasmonics, Transparent optical networks
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-194944DOI: 10.1109/ICTON.2016.7550265ScopusID: 2-s2.0-84985961640ISBN: 9781509014675OAI: oai:DiVA.org:kth-194944DiVA: diva2:1049292
Conference
18th International Conference on Transparent Optical Networks, ICTON 2016, 10 July 2016 through 14 July 2016
Note

QC 20161124

Available from: 2016-11-24 Created: 2016-11-01 Last updated: 2016-11-24Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Wosinski, LechSun, XuThylén, Lars
By organisation
Fotonik och mikrovågsteknik, FMIOptics and Photonics, OFO
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

Altmetric score

ReferencesLink to record
Permanent link

Direct link