Heterogeneous 3D integration of MOEMS and ICs
2016 (English)In: International Conference on Optical MEMS and Nanophotonics, IEEE Computer Society, 2016Conference paper (Refereed)
Heterogeneous integration of micro-opto-electromechanical systems (MOEMS) and integrated circuits (ICs) allows the combination of high-quality optical and photonic MOEMS materials such as monocrystalline silicon (Si) with standard CMOS-based electronic circuits in order to realize complex optical systems. In this paper, we will present examples of such heterogeneous optical systems, including CMOS-integrated SiGe bolometer arrays and CMOS-integrated Si micro-mirror arrays.
Place, publisher, year, edition, pages
IEEE Computer Society, 2016.
bolometer arrays, CMOS, IC, MEMS, micro-mirror arrays, MOEMS, Wafer-level heterogeneous 3D integration, Bolometers, CMOS integrated circuits, Infrared detectors, Integrated circuits, Integration, Mirrors, Monocrystalline silicon, Nanophotonics, Silicon wafers, Three dimensional integrated circuits, 3-D integration, Bolometer array, Complex optical systems, Heterogeneous integration, Integrated circuits (ICs), Micro opto electro mechanical systems, Micromirror array, Standard CMOS
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-194853DOI: 10.1109/OMN.2016.7565909ScopusID: 2-s2.0-84990173946ISBN: 9781509010356OAI: oai:DiVA.org:kth-194853DiVA: diva2:1054560
21st International Conference on Optical MEMS and Nanophotonics, OMN 2016, 31 July 2016 through 4 August 2016
QC 201612082016-12-082016-11-012016-12-08Bibliographically approved