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Modeling of Thermal Stresses and Analysis of Micro-Crack Formations in PCB Laminates
KTH, School of Information and Communication Technology (ICT).
2016 (English)Independent thesis Advanced level (professional degree), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

This Master’s thesis has given me an opportunity to study how, where, when and why cracks appear in the Printed Circuit Board (PCB) laminate. Layout choices contribute to the likelihood of crack formation. Simulations were made on three different locations on one board, the results were then analyzed. Thermal simulation showed nearly no thermal gradient in the board, the temperature inside the board was almost the same as at the surface. This concluded that there was no need for linked thermal and structural simulation. Structural simulations showed that most of the stress and compressions in the laminate was around the vias.

Abstract [sv]

Detta examensarbete har gett mig en möjlighet att studera var, när och varför sprickbildningar sker i mönsterkortslaminaten. Sannolikheten att sprickor bildas påverkas av designen. Simulering på tre olika platser i ett mönsterkort gjordes och resultaten analyserades. En termisk simulering gjordes där resultaten visade en knapp värmegradient i brädan. Temperaturen på ytan var nästan lika stor som inuti brädan, därav slutsatsen att det inte behövs en kopplad termisk och strukturell simulering. I laminaten var det mest stress runt viorna, det var även mest kompression i laminaten kring viorna.

Place, publisher, year, edition, pages
2016. , p. 38
Series
TRITA-ICT-EX ; 2016:10
Keywords [en]
PCB, laminate, crack, stress, deformation, BGA, via, microvia, HDI
Keywords [sv]
PCB, laminat, sprickor, stress, deformation, BGA, via, microvia, HDI
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-205631OAI: oai:DiVA.org:kth-205631DiVA, id: diva2:1089679
Subject / course
Electronic- and Computer Systems
Educational program
Master of Science in Engineering - Microelectronics
Examiners
Available from: 2017-04-20 Created: 2017-04-20 Last updated: 2017-04-20Bibliographically approved

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CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf