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Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators
KTH, School of Engineering Sciences (SCI), Applied Physics, Quantum Nano Photonics.
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2017 (English)In: Journal of Applied Physics, ISSN 0021-8979, E-ISSN 1089-7550, Vol. 121, no 13, 135303Article in journal (Refereed) Published
Abstract [en]

In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobatelead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the "soft" SU8 bonding in comparison to the "hard" bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

Place, publisher, year, edition, pages
AMER INST PHYSICS , 2017. Vol. 121, no 13, 135303
National Category
Physical Sciences
Identifiers
URN: urn:nbn:se:kth:diva-206251DOI: 10.1063/1.4979859ISI: 000398636600035Scopus ID: 2-s2.0-85017180139OAI: oai:DiVA.org:kth-206251DiVA: diva2:1095326
Note

QC 20170512

Available from: 2017-05-12 Created: 2017-05-12 Last updated: 2017-06-30Bibliographically approved

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