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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems. Swerea KIMAB, Sweden.
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems. Swerea KIMAB, Sweden.ORCID iD: 0000-0001-5731-7859
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems.ORCID iD: 0000-0002-1755-1365
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2017 (English)In: 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7936753Conference paper, Published paper (Refereed)
Abstract [en]

In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017. 7936753
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-210878DOI: 10.1109/IWIPP.2017.7936753Scopus ID: 2-s2.0-85025660047ISBN: 9781509042784 (print)OAI: oai:DiVA.org:kth-210878DiVA: diva2:1120625
Conference
2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Delft, Netherlands, 5 April 2017 through 7 April 2017
Note

QC 20170803

Available from: 2017-07-06 Created: 2017-07-06 Last updated: 2017-08-03Bibliographically approved

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CiteExportLink to record
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