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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems.
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems.ORCID iD: 0000-0001-5731-7859
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems.ORCID iD: 0000-0002-1755-1365
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2017 (English)Conference paper, (Refereed)
Place, publisher, year, edition, pages
2017.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:kth:diva-210878OAI: oai:DiVA.org:kth-210878DiVA: diva2:1120625
Conference
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
Available from: 2017-07-06 Created: 2017-07-06 Last updated: 2017-07-21

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Zhang, YafanNee, Hans-Peter
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CiteExportLink to record
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  • apa
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