Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H–SiC devices
2006 (English)In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 46, 743-755 p.Article in journal (Refereed) Published
Al2O3 films were deposited using atomic layer deposition (ALD) and ultrasonic spray pyrolysis (USP) methods on p- and n-type Si substrates, n-type 4H–SiC substrates and 4H–SiC diodes for passivation studies. UV exposure in N2 atmosphere and 5% HF treatment were used as two separate surface preparation procedures prior to Al2O3 deposition. The films deposited with USP technique contain a large amount of fixed negative charge and are vulnerable to water incorporation into the material. The Al2O3 film prepared by ALD method shows much better uniformity and less negative charge. Decrease of the leakage current in the 4H–SiC diodes is observed after Al2O3 passivation using both methods.
Place, publisher, year, edition, pages
2006. Vol. 46, 743-755 p.
mesa diodes, silicon, oxides
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-6598DOI: 10.1016/j.microrel.2005.08.002ISI: 000236838500009ScopusID: 2-s2.0-33645217987OAI: oai:DiVA.org:kth-6598DiVA: diva2:11351
QC 20100928 QC 20111004. Conference: 26th Annual EOS/ESD Symposium. Dallas, TX. SEP 19-23, 2004.2006-12-122006-12-122011-10-04Bibliographically approved