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Thermal improvement of Press-Pack Packages: Pressure Dependent Thermal Contact Resistance with a thin Silver Interlayer between Molybdenum substrate and Silicon Carbide chip
KTH, School of Electrical Engineering (EES), Electric Power and Energy Systems.ORCID iD: 0000-0002-1755-1365
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2017 (English)In: 2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)Article in journal (Refereed) Published
Abstract [en]

In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

Place, publisher, year, edition, pages
IEEE, 2017.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-218243DOI: 10.1109/IWIPP.2017.7936753ISI: 000414286300009Scopus ID: 2-s2.0-85025660047ISBN: 978-1-5090-4278-4 OAI: oai:DiVA.org:kth-218243DiVA, id: diva2:1160077
Conference
IEEE International Workshop on Integrated Power Packaging (IWIPP), APR 05-07, 2017, Delft, NETHERLANDS
Note

QC 20171124

Available from: 2017-11-24 Created: 2017-11-24 Last updated: 2017-11-24Bibliographically approved

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Nee, Hans-Peter

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
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