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Directly printable compact chipless RFID tag for humidity sensing
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. University of Engineering and Technology, Pakistan.
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2017 (English)In: IEICE Electronics Express, ISSN 1349-2543, E-ISSN 1349-2543, Vol. 14, no 10Article in journal (Refereed) Published
Abstract [en]

In this letter, 8-bit paper based printable chipless tag is presented. The tag not only justifies the green electronic concept but also it is examined for sensing functionality. The compact tag structure comprises of seven L-shaped and one I-shaped dipole structure. These conducting tracks/dipole structures are of silver nano-particle based ink having a conductivity of 1.1 × 107 S/m. Each conducting track yields one bit corresponding to one peak. The tag design is optimized and analyzed for three different flexible substrates i.e. paper, Kapton® HN, and PET. The tag has ability to identify 28 = 256 objects, by using different binary combinations. The variation in length of particular conducting strip results in a shift of peak for that specific conducting track. This shift corresponds to logic state-1. The response of the tag for paper, Kapton® HN, and PET substrates is observed in the frequency band of 2.2-6.1 GHz, 2.4-6.3 GHz, and 2.5-6.5 GHz, respectively. The tag has an attractive nature because of its easy printability and usage of low-cost, flexible substrates. The tag can be deployed in various low-cost sensing applications.

Place, publisher, year, edition, pages
Institute of Electronics Information Communication Engineers , 2017. Vol. 14, no 10
Keywords [en]
Backscattering, Chipless tag, RFID, Sensing, Frequency bands, Nanoparticles, Polyimides, Radio frequency identification (RFID), Silver, Substrates, Binary combinations, Conducting strips, Flexible substrate, Green electronics, Sensing applications, Silver-nanoparticles, Humidity sensors
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-216514DOI: 10.1587/elex.14.20170169ISI: 000404583400004Scopus ID: 2-s2.0-85019757377OAI: oai:DiVA.org:kth-216514DiVA, id: diva2:1161889
Note

QC 20171201

Available from: 2017-12-01 Created: 2017-12-01 Last updated: 2017-12-01Bibliographically approved

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Amin, YasarTenhunen, Hannu

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VinnExcellence Center for Intelligence in Paper and Packaging, iPACKIntegrated devices and circuits
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf