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Investigation of PCM-assisted heat pipe for electronic cooling
KTH, School of Industrial Engineering and Management (ITM), Energy Technology.
KTH, School of Industrial Engineering and Management (ITM), Energy Technology.
KTH, School of Industrial Engineering and Management (ITM), Energy Technology.
2017 (English)In: Applied Thermal Engineering, ISSN 1359-4311, E-ISSN 1873-5606, Vol. 127, p. 1132-1142Article in journal (Refereed) Published
Abstract [en]

Today, higher-power computer chips are available, but they generate too much heat that irreparably damages inside components. In this paper, a horizontal phase change material (PCM)-assisted heat pipe system for electronic cooling was introduced as a potential solution to this problem. A computational fluid dynamic model was developed and validated to assist the investigation. A surface temperature profile along the heat pipe was used to validate the CFD model. The liquid fraction and temperature distribution of PCM were reported during the charging process at different input powers. It was found that the PCM-assisted heat pipe provided up to 86.7% of the required cooling load in the working power range of 50–80 W. Contribution of PCM was calculated to be 11.7% of the provided cooling load and preventing heat dissipation. 

Place, publisher, year, edition, pages
Elsevier Ltd , 2017. Vol. 127, p. 1132-1142
Keywords [en]
Heat pipe, Heat transfer, Melting and solidification, Phase change materials
National Category
Environmental Engineering
Identifiers
URN: urn:nbn:se:kth:diva-216818DOI: 10.1016/j.applthermaleng.2017.08.109ISI: 000413608400106Scopus ID: 2-s2.0-85028698630OAI: oai:DiVA.org:kth-216818DiVA, id: diva2:1162660
Note

Export Date: 24 October 2017; Article; CODEN: ATENF; Correspondence Address: Behi, H.; Department of Energy Technology, KTH-Royal Institute of TechnologySweden; email: hbehi@kth.se. QC 20171205

Available from: 2017-12-05 Created: 2017-12-05 Last updated: 2017-12-05Bibliographically approved

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Ghanbarpour, Morteza

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CiteExportLink to record
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