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Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0001-9552-4234
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2017 (English)In: TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, Institute of Electrical and Electronics Engineers (IEEE), 2017, p. 423-426, article id 7994077Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports a narrow footprint sealing ring design for low-temperature, hermetic, and mechanically stable wafer-level packaging. Copper (Cu) sealing rings that are as narrow as 8 μm successfully seal the enclosed cavities on the wafers after bonding at a temperature of 250 °C. Different sealing structure designs are evaluated and demonstrate excellent hermeticity after 3 months of storage in ambient atmosphere. A leak rate of better than 3.6×10'16 mbarL/s is deduced based on results from residual gas analysis measurements. The sealing yield after wafer bonding is found to be not limited by the Cu sealing ring width but by a maximum acceptable wafer-to-wafer misalignment.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017. p. 423-426, article id 7994077
Keywords [en]
Actuators, Copper, Electronics packaging, Microsystems, Sealing (closing), Solid-state sensors, Temperature, Transducers, Ambient atmosphere, Hermeticity, Low temperatures, Mechanically stable, Residual gas analysis, Sealing ring, Sealing structures, Wafer level packaging, Wafer bonding
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Other Chemistry Topics
Identifiers
URN: urn:nbn:se:kth:diva-216276DOI: 10.1109/TRANSDUCERS.2017.7994077ISI: 000426701400105Scopus ID: 2-s2.0-85029393420ISBN: 9781538627310 OAI: oai:DiVA.org:kth-216276DiVA, id: diva2:1166672
Conference
19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, 18 June 2017 through 22 June 2017
Note

QC 20171215

Available from: 2017-12-15 Created: 2017-12-15 Last updated: 2018-04-17Bibliographically approved

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Bleiker, Simon J.Stemme, GöranNiklaus, Frank

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Wang, XiaojingBleiker, Simon J.Stemme, GöranNiklaus, Frank
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