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High frequency transmission lines crosstalk reduction using spacing rules
KTH, School of Information and Communication Technology (ICT), Microelectronics and Applied Physics, MAP.
Department of Electronic Production, Mid Sweden University, ITM, Östersund.
Department of Electronic Production, Mid Sweden University, ITM, Östersund.
2008 (English)In: IEEE transactions on components and packaging technologies, ISSN 1521-3331, Vol. 31, no 3, 601-610 p.Article in journal (Refereed) Published
Abstract [en]

High-frequency transmission lines crosstalk reduction using spacing rules is treated in this paper. Two of the most popular planar transmission line configurations, namely microstrip and stripline, commonly used in printed circuit boards and radio frequency/microwave integrated circuits, are considered in this work. The trace separation between two adjacent transmission lines of each type is stepwise increased as function of the trace width. The single-ended transmission line structures are numerically investigated by a frequency-based 3-D full-wave electromagnetic analysis tool. A particular case using coated microstrip transmission lines has been fabricated, along with some calibration structures, to allow direct measurement and experimental analysis of crosstalk between the single-ended transmission lines. The test structures are characterized at high-frequency (up to 20 GHz) with scattering parameters using a vector network analyzer. The experimental results are compared with the simulation data, and some conclusions and suggestions on the impact and use of spacing rules for high-frequency crosstalk reduction between single-ended transmission lines are presented. These investigations emphasize the necessity of reevaluating classical design rules for their suitability in high-frequency applications.

Place, publisher, year, edition, pages
2008. Vol. 31, no 3, 601-610 p.
Keyword [en]
Far-end crosstalk (FEXT); High-frequency crosstalk; Near-end crosstalk (NEXT); S-parameter measurement; Spacing rules; Bandpass filters; Crosstalk; Electric lines; Electric network analysis; Electric network analyzers; Electronic equipment manufacture; Integrated circuits; Network protocols; Networks (circuits); Opacity; Optical properties; Power transmission; Printed circuit boards; Printed circuit manufacture; Radio transmission; Sensor networks; Separation; Transmission line theory; Far-end crosstalk (FEXT); High-frequency crosstalk; Near-end crosstalk (NEXT); S-parameter measurement; Spacing rules; Radio broadcasting
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-6946DOI: 10.1109/TCAPT.2008.2001163ISI: 000259573600010Scopus ID: 2-s2.0-54849376700OAI: oai:DiVA.org:kth-6946DiVA: diva2:11802
Note
QC 20100810. Uppdaterad från Submitted till Published 20100810.Available from: 2007-04-10 Created: 2007-04-10 Last updated: 2010-08-10Bibliographically approved
In thesis
1. Some Aspects of Advanced Technologies and Signal Integrity Issues in High Frequency PCBs, with Emphasis on Planar Transmission Lines and RF/Microwave Filters
Open this publication in new window or tab >>Some Aspects of Advanced Technologies and Signal Integrity Issues in High Frequency PCBs, with Emphasis on Planar Transmission Lines and RF/Microwave Filters
2007 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

The main focus of this thesis is placed on high frequency PCB signal Integrity Is-sues and RF/Microwave filters using EBG structures.

From the signal Integrity aspect, two topics were mainly discussed. On one hand, the effect of increasing frequency on classical design rules for crosstalk reduction in PCBs was investigated experimentally and by full-wave simulations. An emphasis was placed on the 3×W spacing rule and the use of guard traces. Single-ended and differential transmission lines were considered. S-parameter measurements and simu-lations were carried out at high-frequency (up to 20 GHz). The results emphasize the necessity to reevaluate traditional design rules for their suitability in high frequency applications. Also, the impacts of using guard traces for high frequency crosstalk re-duction were clearly pointed out. On the other hand, the effect of high loss PCB ma-terials on the signal transmission characteristics of microstrip lines at high frequency (up to 20 GHz) was treated. Comparative studies were carried out on different micro-strip configurations using standard FR4 substrate and a high frequency dielectric ma-terial from Rogers, Corporation. The experimental results highlight the dramatic im-pact of high dielectric loss materials (FR4 and solder mask) and magnetic plating metal (nickel) on the high frequency signal attenuation and loss of microstrip trans-mission lines.

Besides, the epoxy-based SU8 photoresist was characterized at high frequency (up to 50 GHz) using on-wafer conductor-backed coplanar waveguide transmission lines. A relative dielectric constant of 3.2 was obtained at 30 GHz. Some issues related to the processing of this material, such as cracks, hard-skin, etc, were also discussed.

Regarding RF/Microwave filters, the concept of Electromagnetic Band Gap (EBG) was used to design and fabricate novel microstrip bandstop filters using periodically modified substrate. The proposed EBG structures, which don’t suffer conductor backing issues, exhibit interesting frequency response characteristics.

The limitations of modeling and simulation tools in terms of speed and accuracy are also examined in this thesis. Experiments and simulations were carried out show-ing the inadequacies of the Spice diode model for the simulations in power electronics. Also, an Artificial Neural Network (ANN) model was proposed as an alternative and a complement to full-wave solvers, for a quick and sufficiently accurate simulation of interconnects. A software implementation of this model using Matlab’s ANN toolbox was shown to considerably reduce (by over 800 times) the simulation time of microstrip lines using full-wave solvers such as Ansoft’s HFSS and CST’s MWS.

Finally, a novel cooling structure using a double heatsink for high performance electronics was presented. Methods for optimizing this structure were also discussed.

Place, publisher, year, edition, pages
Stockholm: KTH, 2007. xvii, 77 p.
Series
Trita-ICT/MAP, 2007:03
Keyword
Signal integrity, crosstalk, guard trace, PCB, transmission line loss, high frequency measurement, dielectric, SU-8, electromagnetic bandgap, microwave filter
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-4324 (URN)978-91-7178-605-0 (ISBN)
Public defence
2007-04-17, Rum 5435, KTH-Electrum, Isafjordsg. 22, Kista, 10:00
Opponent
Supervisors
Note
QC 20100809Available from: 2007-04-10 Created: 2007-04-10 Last updated: 2011-09-30Bibliographically approved

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