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THz MEMS - micromachining enabling new solutions at millimeter and submillimeter-wave frequencies (Invited Paper)
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2017 (English)In: 2017 IEEEĀ Asia Pacific Microwave Conference (APMC) / [ed] Pasya, I Seman, FC, Institute of Electrical and Electronics Engineers (IEEE), 2017, p. 81-84Conference paper, Published paper (Refereed)
Abstract [en]

Since RF MEMS switches appeared more than 20 years ago, micromachining and micromechanics have been receiving large attention for enabling near-ideal microwave devices. MEMS switches and MEMS-switch based circuits have been through different development stages and are currently proving themselves commercially, among others for mobile-phone antenna-tuner switched-capacitor banks. However, micromachining can do much more than just two-dimensional MEMS switches for planar transmission-line technology: Three-dimensional, deep-silicon micromachining allows for new microwave devices with unprecedented performance, and has the potential to become an enabling technology for volume-manufacturable, reconfigurable submillimeter-wave and THz systems. This paper provides an overview of 3D silicon micromachining capability, and recent achievements of innovative microwave devices and systems enabled by micromachining high up into the THz spectrum are given, including the first MEMS-reconfigurable submillimeter-wave devices. Highlights of devices presented are a 3.3 bit MEMS phase shifter and a low-insertion loss / high-isolation MEMS waveguide switch operating at 500-750 GHz, and a micromachined technology for multi-pole, multi-transmission zero filers which enables multi-mode resonators with Q factors of 800 at 270 GHz. Furthermore, a technology is shown for very low loss micromachined waveguides with only 0.02 dB/mm loss at 200-300 GHz, which has enabled ultra-low loss waveguide components such as couplers and power combiners/splitters.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017. p. 81-84
Series
Asia Pacific Microwave Conference-Proceedings
Keywords [en]
THz MEMS, micromachining, micromachined waveguides, phase shifters, micro-electromechanical systems, MEMS switches
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-224736ISI: 000426648000021ISBN: 978-1-5386-0640-7 (print)OAI: oai:DiVA.org:kth-224736DiVA, id: diva2:1192668
Conference
2017 IEEE Asia Pacific Microwave Conference (APMC), NOV 13-16, 2017, Kuala Lumpur, MALAYSIA
Note

QC 20180323

Available from: 2018-03-23 Created: 2018-03-23 Last updated: 2018-03-23Bibliographically approved

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Oberhammer, Joachim

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