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A Lifetime-aware Mapping Algorithm to Extend MTTF of Networks-on-Chip
KTH, School of Electrical Engineering and Computer Science (EECS), Electronics, Integrated devices and circuits.
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2018 (English)In: 2018 23rd Asia and South Pacific Design Automation Conference Proceedings (ASP-DAC), Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 147-152Conference paper, Published paper (Refereed)
Abstract [en]

Fast aging of components has become one of the major concerns in Systems-on-Chip with further scaling of the submicron technology. This problem accelerates when combined with improper working conditions such as unbalanced components' utilization. Considering the mapping algorithms in the Networks-on-Chip domain, some routers/links might be frequently selected for mapping while others are underutilized. Consequently, the highly utilized components may age faster than others which results in disconnecting the related cores from the network. To address this issue, we propose a mapping algorithm, called lifetime-aware neighborhood allocation (LaNA), that takes the aging of components into account when mapping applications. The proposed method is able to balance the wear-out of NoC components, and thus extending the service time of NoC. We model the lifetime as a resource consumed over time and accordingly define the lifetime budget metric. LaNA selects a suitable node for mapping which has the maximum lifetime budget. Experimental results show that the lifetime-aware mapping algorithm could improve the minimal MTTF of NoC around 72.2%, 58.3%, 46.6% and 48.2% as compared to NN, CoNA, WeNA and CASqA, respectively.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 147-152
Series
Asia and South Pacific Design Automation Conference Proceedings, ISSN 2153-6961
Keywords [en]
many-core system, Network-on-Chip, mapping algorithm, lifetime reliability
National Category
Other Engineering and Technologies
Identifiers
URN: urn:nbn:se:kth:diva-225090ISI: 000426987100024Scopus ID: 2-s2.0-85045333574ISBN: 978-1-5090-0602-1 (print)OAI: oai:DiVA.org:kth-225090DiVA, id: diva2:1193960
Conference
23rd Asia and South Pacific Design Automation Conference (ASP-DAC), JAN 22-25, 2018, Jeju, South Korea
Funder
VINNOVA
Note

QC 20180328

Available from: 2018-03-28 Created: 2018-03-28 Last updated: 2018-03-28Bibliographically approved

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Ebrahimi, Masoumeh

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CiteExportLink to record
Permanent link

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Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
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