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THz MEMS - Micromachining enabling new solutions at millimeter and submillimeter-wave frequencies (invited paper)
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2018 (English)In: Asia-Pacific Microwave Conference Proceedings, APMC, Institute of Electrical and Electronics Engineers Inc. , 2018, p. 81-84Conference paper, Published paper (Refereed)
Abstract [en]

Since RF MEMS switches appeared more than 20 years ago, micromachining and micromechanics have been receiving large attention for enabling near-ideal microwave devices. MEMS switches and MEMS-switch based circuits have been through different development stages and are currently proving themselves commercially, among others for mobile-phone antenna-tuner switched-capacitor banks. However, micromachining can do much more than just two-dimensional MEMS switches for planar transmission-line technology: Three-dimensional, deep-silicon micromachining allows for new microwave devices with unprecedented performance, and has the potential to become an enabling technology for volume-manufacturable, reconfigurable submillimeter-wave and THz systems. This paper provides an overview of 3D silicon micromachining capability, and recent achievements of innovative microwave devices and systems enabled by micromachining high up into the THz spectrum are given, including the first MEMS-reconfigurable submillimeter-wave devices. Highlights of devices presented are a 3.3 bit MEMS phase shifter and a low-insertion loss / high-isolation MEMS waveguide switch operating at 500-750 GHz, and a micromachined technology for multi-pole, multi-transmission zero filers which enables multi-mode resonators with Q factors of 800 at 270 GHz. Furthermore, a technology is shown for very low loss micromachined waveguides with only 0.02 dB/mm loss at 200-300 GHz, which has enabled ultra-low loss waveguide components such as couplers and power combiners/splitters. 

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2018. p. 81-84
Keywords [en]
MEMS switches, micro-electromechanical systems, micromachined waveguides, micromachining, phase shifters, THz MEMS, Composite micromechanics, Electric switches, MEMS, Microwave devices, Microwaves, Mobile antennas, Q factor measurement, Submillimeter waves, Waveguide components, Micro electro mechanical system, Micro-machined, Planar transmission lines, Silicon micromachining, Sub-millimeter wave frequencies, Submillimeter-wave devices, Switched capacitor banks, Terahertz waves, Frequencies, Silicon, Systems, Technology, Transmission
National Category
Computer and Information Sciences
Identifiers
URN: urn:nbn:se:kth:diva-227462DOI: 10.1109/APMC.2017.8251382Scopus ID: 2-s2.0-85044764585ISBN: 9781538606407 OAI: oai:DiVA.org:kth-227462DiVA, id: diva2:1209461
Conference
2017 IEEE Asia Pacific Microwave Conference, APMC 2017, 13 November 2017 through 16 November 2017
Note

Conference code: 134147; Export Date: 9 May 2018; Conference Paper; Correspondence Address: Oberhammer, J.; School of Electrical Engineering, KTH Royal Institute of TechnologySweden; email: joachimo@kth.se. QC 20180523

Available from: 2018-05-23 Created: 2018-05-23 Last updated: 2018-05-23Bibliographically approved

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