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Wafer-Scale Transfer of Graphene by Adhesive Wafer Bonding
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0003-3936-818X
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.
(AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, GERMANY)
(AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, GERMANY)
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2019 (English)Conference paper, Published paper (Refereed)
Abstract [en]

Graphene is an extremely promising material for emerging nanoelectromechanical systems (NEMS) and sensors, but the transfer from its growth substrate to silicon substrates remains manual and laborious. We report a novel method for the transfer of large-area chemical vapor deposited (CVD) graphene from copper foil to a target wafer by adhesive wafer bonding using bisbenzocyclobutene (BCB) as an intermediate adhesive layer. The use of conventional wafer bonding equipment enables the scalable transfer of graphene and the realization of both supported and suspended graphene devices on wafer-scale. Our method circumvents manual handling of graphene after release from its growth substrate and avoids polymeric carrier layers, a well-known source of contamination. Hence, the proposed process promises the transfer of graphene with high quality and repeatability.

Place, publisher, year, edition, pages
2019.
National Category
Nano Technology
Identifiers
URN: urn:nbn:se:kth:diva-244052OAI: oai:DiVA.org:kth-244052DiVA, id: diva2:1298950
Conference
32nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2019)
Note

QS 20190404

Available from: 2019-03-25 Created: 2019-03-25 Last updated: 2019-04-04Bibliographically approved

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