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The adhesion of tungsten dust on plasma-exposed tungsten surfaces
KTH, School of Electrical Engineering and Computer Science (EECS), Space and Plasma Physics.ORCID iD: 0000-0001-9632-8104
CNR, Ist Fis Plasma, Via Corsi 53, I-20125 Milan, Italy..
CNR, Inst Condensed Matter Chem & Energy Technol, Via Cozzi 53, I-20125 Milan, Italy..
KTH, School of Electrical Engineering and Computer Science (EECS), Space and Plasma Physics.ORCID iD: 0000-0002-6712-3625
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2019 (English)In: Nuclear Materials and Energy, E-ISSN 2352-1791, Vol. 18, p. 18-22Article in journal (Refereed) Published
Abstract [en]

The adhesion of tungsten dust is measured on plasma-exposed and non-exposed tungsten substrates with the electrostatic detachment method. Tungsten substrates of comparable surface roughness have been exposed to the deuterium plasmas of the GyM linear device and the argon plasmas of rf glow discharges under conditions which invariably modify the surface composition due to physical sputtering. The adhesion has been systematically characterized for different spherical nearly monodisperse dust populations. Independent of the dust size, an approximate 50% post-exposure reduction of the average and spread of the adhesive force has been consistently observed and attributed to surface chemistry modifications.

Place, publisher, year, edition, pages
ELSEVIER SCIENCE BV , 2019. Vol. 18, p. 18-22
Keywords [en]
Dust adhesion, Pull-off force, Dust remobilization, Electrostatic detachment, Adsorbates, Sputtering
National Category
Physical Sciences
Identifiers
URN: urn:nbn:se:kth:diva-247856DOI: 10.1016/j.nme.2018.12.002ISI: 000460107500004OAI: oai:DiVA.org:kth-247856DiVA, id: diva2:1299099
Note

QC 20190326

Available from: 2019-03-26 Created: 2019-03-26 Last updated: 2019-03-26Bibliographically approved

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Tolias, PanagiotisRatynskaia, Svetlana V.

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