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An ASIC Design of Multi-Electrode Digital Basket Catheter Systems with Reconfigurable Compressed Sampling
KTH, School of Electrical Engineering and Computer Science (EECS).
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2019 (English)In: International System on Chip Conference, IEEE Computer Society , 2019, p. 308-313Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents an Application Specific Integrated Circuit (ASIC) design with reconfigurable compressed sampling (CS) for multi-electrode basket catheter systems that acquire intracardiac electrograms (IEGMs). This work adopts a reconfigurable CS (ReCS) encoder for near-electrode processing to enable sub-Nyquist sampling rate thus improve the system capacity. The ReCS encoder is designed to work with a reconfigurable compression cycle as well as a reconfigurable compression ratio, which makes it suitable for a wide range of different signals. This digital ASIC chip is placed at the distal end of the catheter close to electrodes, so that all signals have been digitalized and encoded before transmitting to an external receiver. Such architecture ensures serial data transmission, reducing number of traces and size of the catheter, as well as fabrication complexity. Evaluated area cost of total digital circuits is 0.046 mm 2 and the power consumption is 49.1 μW with 4 MHz clock frequency in 65 nm process.

Place, publisher, year, edition, pages
IEEE Computer Society , 2019. p. 308-313
Keywords [en]
basket catheter, compressed sampling, digital catheter, Catheters, Electrodes, Integrated circuit design, Programmable logic controllers, Rhenium compounds, Signal encoding, Clock frequency, Compressed samplings, Electrode processing, Intracardiac electrograms, Multi-electrode, Serial data transmissions, Sub-Nyquist sampling, System Capacity, Application specific integrated circuits
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-248273DOI: 10.1109/SOCC.2018.8618535ISI: 000462047000023Scopus ID: 2-s2.0-85062213797ISBN: 9781538614907 (print)OAI: oai:DiVA.org:kth-248273DiVA, id: diva2:1303082
Conference
31st IEEE International System on Chip Conference, SOCC 2018, 4 September 2018 through 7 September 2018
Note

QC 20190408

Available from: 2019-04-08 Created: 2019-04-08 Last updated: 2019-04-09Bibliographically approved

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Huan, Yuxiang

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