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FUNDAMENTAL MODELLING OF MECHANISMS CONTRIBUTING TO TERTIARY CREEP IN COPPER AT 215 AND 250 degrees C
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.ORCID iD: 0000-0002-8494-3983
2019 (English)In: PROCEEDINGS OF THE ASME PRESSURE VESSELS AND PIPING CONFERENCE, 2018, / [ed] Qian, H; Brongers, M; Uddin, M, AMER SOC MECHANICAL ENGINEERS , 2019Conference paper, Published paper (Refereed)
Abstract [en]

Extensive creep tests have been performed on oxygen free copper with 50 ppm phosphorus at both low and high temperatures. It is the candidate material for storage of spent nuclear fuel in Sweden. Basic models without fitting parameters have been formulated to reproduce primary and secondary creep. For a long time, only empirical models existed for fitting of tertiary creep. To understand the role of creep damage, including recovery, cavitation and necking, basic models that do not involve adjustable parameters are in urgent demand. Only recently, basic models taking the relevant mechanisms into account have been developed. These models were used to predict the tertiary creep for copper at 75 degrees C. The modelled results were compared with experimental creep curves and good agreement has been found. In the present paper, the models are applied to creep tests at higher temperatures (215 and 250 degrees C). A similar representation with good accuracy is obtained. This demonstrates that the fundamental model for back stress is applicable for the higher temperature tests as well.

Place, publisher, year, edition, pages
AMER SOC MECHANICAL ENGINEERS , 2019.
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:kth:diva-248108ISI: 000460998900049Scopus ID: 2-s2.0-85056835819OAI: oai:DiVA.org:kth-248108DiVA, id: diva2:1307733
Conference
ASME 2018 Pressure Vessels and Piping Conference, PVP 2018; Prague; Czech Republic; 15 July 2018 through 20 July 2018
Note

QC 20190429

Available from: 2019-04-29 Created: 2019-04-29 Last updated: 2019-04-29Bibliographically approved

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Sui, FangfeiSandström, Rolf

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