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A thermal balance oriented task mapping for CMPs
KTH, School of Industrial Engineering and Management (ITM), Machine Design (Dept.), Mechatronics.
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2018 (English)In: ACM International Conference Proceeding Series, Association for Computing Machinery , 2018, p. 12-16Conference paper, Published paper (Refereed)
Abstract [en]

CMP (Chip Multi Processors) has been concerned and applied in more and more fields. With the technical progress in semiconductor manufacturing, the focus/research on on-chip power density and heat generation of the chips are increasing. The heat distribution of the chip heavily affects its reliability. In this article a heat-balancing task mapping algorithm is proposed to optimize the heat distribution and ensure the reliability of CMP. First, the thermal distribution of CMP is analyzed by what. Then, based on above analysis, a cost function based on usage and location of on-chip processors is proposed. Finally, a mapping algorithm based on above cost function is .developed to assign threads to cores while running applications with the min-cost principle dynamically. The simulation results revel that the heat-balancing algorithm proposed effectively optimizes heat distribution and ensures computational performance either.

Place, publisher, year, edition, pages
Association for Computing Machinery , 2018. p. 12-16
Keywords [en]
Conformal mapping, Cost functions, Multiprocessing systems, Semiconductor device manufacture, Balancing algorithms, Chip multi-processors, Computational performance, Mapping algorithms, Running applications, Semiconductor manufacturing, Technical progress, Thermal distributions, Cost benefit analysis
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-247194DOI: 10.1145/3268891.3268902ISI: 000473336900003Scopus ID: 2-s2.0-85055702310ISBN: 9781450365024 (print)OAI: oai:DiVA.org:kth-247194DiVA, id: diva2:1313693
Conference
8th International Conference on Information Communication and Management, ICICM 2018, 22 August 2018 through 24 August 2018
Note

QC 20190506

Available from: 2019-05-06 Created: 2019-05-06 Last updated: 2019-07-29Bibliographically approved

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