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Density of tin, silver and copper
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
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2018 (English)In: Archives of Materials Science and Engineering, ISSN 1897-2764, Vol. 92, no 1, p. 28-32Article in journal (Refereed) Published
Abstract [en]

Purpose: Purpose of this paper is to report on the development of a new density measure­ment cell. Design/methodology/approach: Measurement cell based on Archimedean principle and consisting of induction furnace and a high/precision balance was applied for measurement of tin, silver and copper density. Findings: It was found that new cell is suitable for high temperature measurement of liquid metals density at temperatures from 700 to 1520°C. Measurement results are in a good agreement with the literature values. Density deviates by 0.5-1% depending on the metal. Research limitations/implications: Accuracy of the density measurement decreases at temperatures below 700°C due to oxidation of the melt surface. More accurate data on thermal expansion coefficient for sinker material is required. Practical implications: Experiments showed applicability of the new measurement cell. Archimedean principle is among the most sensitive density measurement techniques. New cell will be further used for measurement of iron-based alloys. Problems of measurements are discussed. Originality/value: Paper describes application of the known density measurement technique. The paper is of interest for the material scientists working with high-temperature thermophysical properties measurements and users of thermophysical properties data. 

Place, publisher, year, edition, pages
International OCSCO World Press , 2018. Vol. 92, no 1, p. 28-32
Keywords [en]
Archimedes, Copper, Density, Silver, Tin
National Category
Metallurgy and Metallic Materials
Identifiers
URN: urn:nbn:se:kth:diva-252266DOI: 10.5604/01.3001.0012.5509Scopus ID: 2-s2.0-85065134609OAI: oai:DiVA.org:kth-252266DiVA, id: diva2:1321185
Note

QC20190607

Available from: 2019-06-07 Created: 2019-06-07 Last updated: 2019-06-07Bibliographically approved

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Seetharaman, Seshadri

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