Wire electronics and woven logic, as a potential technology for neuroelectronic implants
(English)Manuscript (Other (popular science, discussion, etc.))
New strategies to improve neuron coupling to neuroelectronic implants are needed. In particular, to maintain functional coupling between implant and neurons, foreign body response like encapsulation must me minimized. Apart from modifying materials to mitigate encapsulation it has been shown that with extremely thin structures, encapsulation will be less pronounced. We here utilize wire electrochemical transistors (WECTs) using conducting polymer coated fibers. Monofilaments down to 10 μm can be successfully coated and weaved into complex networks with built in logic functions, so called textile logic. Such systems can control signal patterns at a large number of electrode terminals from a few addressing fibres. Not only is fibre size in the range where less encapsulation is expected but textiles are known to make successful implants because of their soft and flexible mechanical properties. Further, textile fabrication provides versatility and even three dimensional networks are possible. Three possible architectures for neuroelectronic systems are discussed. WECTs are sensitive to dehydration and materials for better durability or improved encapsulation is needed for stable performance in biological environments.
conducting polymers, functional electrical stimulation, textile electronics
Other Engineering and Technologies not elsewhere specified
IdentifiersURN: urn:nbn:se:kth:diva-9847OAI: oai:DiVA.org:kth-9847DiVA: diva2:133571
QC 201006232009-01-122009-01-122010-07-19Bibliographically approved