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Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.), Solid Mechanics (Div.).ORCID iD: 0000-0002-0307-8917
2006 (English)In: Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations, 2006Conference paper, Oral presentation only (Refereed)
Place, publisher, year, edition, pages
2006.
National Category
Applied Mechanics
Research subject
Solid Mechanics
Identifiers
URN: urn:nbn:se:kth:diva-255870OAI: oai:DiVA.org:kth-255870DiVA, id: diva2:1342661
Conference
7th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimeE 2006
Note

QC 20190902

Available from: 2019-08-14 Created: 2019-08-14 Last updated: 2019-09-02Bibliographically approved

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Gudmundson, Peter

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