Concurrent chip-package design for 10GHz global clock distribution network
2005 (English)In: 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, 1554-1559 p.Conference paper (Refereed)
As a result of the continuous downscaling of the CMOS technology, on chip frequency for high performance microprocessor will soon arrive 10GHz according to international technology roadmap for semiconductors (ITRS). In this paper, a 10GHz global clock distribution network using standing wave approach was analyzed on chip and package level. On chip level, a 10GHz standing wave oscillator (SWO) for global clock distribution network using 0.18um, 1P6M CMOS technology, is designed and analyzed. The simulation results show that the skew is well controlled (about 1ps) while the clock frequency variation is about 20% because power/ground return paths exist in different metal layers. On package level, we assume that the chip size is 20mm*20mm and flip-chip bonding technology is used. The simulation results show that the skew at random positions of the transmission line (spiral or serpentine shape) is within 10% of tau(clk) when the attenuation is about 1.5dB. For attenuation from 1.5dB to 6.7dB, the peak positions (n*lambda/2) can be used as clock node. For the mesh and plane shape, the skew is controlled within 10% of tau(clk) using standing wave method.
Place, publisher, year, edition, pages
2005. 1554-1559 p.
, Proceedings - Electronic Components and Technology Conference, ISSN 0569-5503
Attenuation, Clocks, CMOS integrated circuits, Concurrent engineering, Microprocessor chips, Semiconductor device manufacture, Transmission line theory
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-8474DOI: 10.1109/ECTC.2005.1441995ISI: 000230581600243ScopusID: 2-s2.0-24644487124ISBN: 0-7803-8906-9OAI: oai:DiVA.org:kth-8474DiVA: diva2:13807
Electronic Components and Technology Conference, 2005. Proceedings. 55th, Lake Buena Vista, Florida, USA, May 31- June 3, 2005
QC 201010062005-11-032005-11-032014-12-04Bibliographically approved