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Optimization of Curing Behavior of Si3N4 UV Resin for Photopolymerization 3D Printing
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Ceramics. KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Applied Process Metallurgy.ORCID iD: 0000-0003-3060-9987
2019 (English)In: IOP Conference Series: Materials Science and Engineering, Institute of Physics Publishing , 2019, no 1Conference paper, Published paper (Refereed)
Abstract [en]

Silicon nitride (Si3N4) ceramics are widely used in mechanical and thermal management applications due to their excellent properties. To overcome the difficulties in traditional Si3N4 ceramic forming techniques, it is interesting to see the possibility of making complex-shaped silicon nitride ceramic component with novel 3D printing methods. In this study, we aim to study the effect of photo-initiators on the curing behavior of pre-formulated Si3N4 ceramic UV resin suspension. To elucidate the potential multi-factor interactions, a statistic experiment design was implemented in a sequence of screening and optimization by using Modde software. It was found that the kinds of photo-initiators, total amount of initiators and the mixture ratio between initiators have a great influence on the curing properties of silicon nitride UV ceramic resin. Based on these results, a formula was selected based on the criterion of using least amount photo-initiator while reaching the highest curing thickness.

Place, publisher, year, edition, pages
Institute of Physics Publishing , 2019. no 1
National Category
Tribology (Interacting Surfaces including Friction, Lubrication and Wear)
Identifiers
URN: urn:nbn:se:kth:diva-272327DOI: 10.1088/1757-899X/678/1/012013Scopus ID: 2-s2.0-85078314309OAI: oai:DiVA.org:kth-272327DiVA, id: diva2:1430149
Conference
The 11th International Conference on High-Performance Ceramics 25–29 May 2019, Kunming, China
Note

QC 20200513

Available from: 2020-05-13 Created: 2020-05-13 Last updated: 2020-05-13Bibliographically approved

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Zhao, Zhe

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