Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, datacenters suffer from increasing number of interconnections dictating the deployment of novel architectures and high-radix switches. The ratification of 400 GbE standard is driving the market of optical transceivers nevertheless, a technology upgrade will be soon necessary to meet the tremendous traffic growth. In this paper, we present the development of 800 Gb/s and 1Tb/s optical transceivers migrating to 100 Gbaud per lane and employing wafer-scale bonding of InP membranes and InP-DHBT electronics as well as advanced co-packaging schemes. The InP membrane platform is also exploited for the development of novel ultra-fast optical space switches based on a modular architecture design for scaling to large number of I/O ports.