kth.sePublications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Miniaturized Slot Based Chipless RFID Tag for IoT Applications
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. TUCS, Department of Information Technology, Univrsity of Turku, Finland.ORCID iD: 0000-0003-4968-993X
Show others and affiliations
2019 (English)In: RAEE 2019 - International Symposium on Recent Advances in Electrical Engineering, Institute of Electrical and Electronics Engineers Inc. , 2019Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, a compact 13-bit fully passive chipless RFID tag is presented. The overall size of the proposed chipless tag is 16.65 mm x 17 mm. The resonating structure is loaded with thirteen C-shaped nested slots. The presented tag is optimized and analyzed for three distinct substrates that are, Rogers RT/duroid®/5870, Taconic TLX-0 and Rogers RT/duroid®/5880. The articulated tag structure possesses the capability of generating 213= 8192 exclusive IDs for low-cost identification of various objects. Flexibility is achieved using Rogers RT/duroid®/5880 substrate over the aspired frequency band of 3 GHz - 12 GHz. Hence, the robust chipless tag is an ideal choice to be deployed on curved surfaces for different cost effective IoT based industrial applications. 

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2019.
Keywords [en]
Chipless, flexible, low-cost, radio frequency identification, Cost effectiveness, Costs, Radio frequency identification (RFID), Substrates, Cost effective, Curved surfaces, IOT applications, Low costs, Miniaturized slot, Resonating structures, Internet of things
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-301503DOI: 10.1109/RAEE.2019.8887068Scopus ID: 2-s2.0-85075344343OAI: oai:DiVA.org:kth-301503DiVA, id: diva2:1594299
Conference
3rd IEEE International Symposium on Recent Advances in Electrical Engineering, RAEE 2019, 28 August 2019 through 29 August 2019
Note

QC 20210915

Part of ISBN 9781728130729

Available from: 2021-09-15 Created: 2021-09-15 Last updated: 2024-10-21Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Amin, Yasar

Search in DiVA

By author/editor
Amin, Yasar
By organisation
VinnExcellence Center for Intelligence in Paper and Packaging, iPACK
Other Electrical Engineering, Electronic Engineering, Information EngineeringTelecommunications

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 30 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf