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Electronic module assembly
Friedrich Alexander Univ Erlangen Nurnberg, Inst Factory Automat & Prod Syst, Erlangen, Germany..
KTH, School of Industrial Engineering and Management (ITM), Production Engineering, Sustainable Production Systems.ORCID iD: 0000-0001-8679-8049
TU Dresden Univ Dresden, Inst Elect Packaging Technol, Dresden, Germany..
Albert Ludwig Univ Freiburg, Inst Microsyst Technol, Freiburg, Germany..
2021 (English)In: CIRP annals, ISSN 0007-8506, E-ISSN 1726-0604, Vol. 70, no 2, p. 471-493Article in journal (Refereed) Published
Abstract [en]

Electronics is the vital basis for innovations and the essential enabler for global trends like connectivity, electro mobility and renewable energies. These applications require high performance and reliability of the electronic modules. Their assembly combines very heterogeneous process chains like remarkable productive and diminutive surface mount technology (SMT), powerful and robust power electronic interconnection techniques, as well as pioneering reel-to-reel based organic electronic printing. After briefly outlining the enormous global economic impact of electronic modules, this paper presents the state of the art of electronic module assembly including substrate materials, electronic components, packaging and assembly processes as well as quality and reliability testing methods.

Place, publisher, year, edition, pages
Elsevier BV , 2021. Vol. 70, no 2, p. 471-493
Keywords [en]
Joining, Assembly, Electronic
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-302014DOI: 10.1016/j.cirp.2021.05.005ISI: 000692027100001Scopus ID: 2-s2.0-85109712001OAI: oai:DiVA.org:kth-302014DiVA, id: diva2:1594740
Available from: 2021-09-16 Created: 2021-09-16 Last updated: 2022-06-25Bibliographically approved

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Wang, Lihui

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