Interfacing telecom fibers and silicon core fibers with nano-spikes for in-fiber silicon devicesShow others and affiliations
2018 (English)In: 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc. (IEEE) , 2018, p. 1-3Conference paper, Published paper (Refereed)
Abstract [en]
We report fabrication of tapered silicon core fibers with nano-spikes enabling efficient optical coupling into the core, as well as their seamless integration with single mode fibers. A proof-of-concept integrated in-fiber silicon device is demonstrated.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. (IEEE) , 2018. p. 1-3
Keywords [en]
Electron devices, Optical fiber fabrication, Optical fibers, Silicon, Single mode fibers, In-fiber, Optical couplings, Proof of concept, Seamless integration, Silicon cores, Silicon devices, Telecom fibers, Optical fiber communication
National Category
Atom and Molecular Physics and Optics
Identifiers
URN: urn:nbn:se:kth:diva-302065ISI: 000437286300546Scopus ID: 2-s2.0-85050020757OAI: oai:DiVA.org:kth-302065DiVA, id: diva2:1597925
Conference
2018 Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, 11-15 March 2018
Note
Syskonpost
Not duplicate with DiVA 1212997
QC 20210928
2021-09-282021-09-282022-06-25Bibliographically approved