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Investigation on the microstructure evolution and dynamic recrystallization mechanisms of TiAl alloy at elevated temperature
Univ Sci & Technol Beijing, Inst Engn & Technol, Beijing 100083, Peoples R China..
Univ Sci & Technol Beijing, Inst Engn & Technol, Beijing 100083, Peoples R China..
Univ Sci & Technol Beijing, Inst Engn & Technol, Beijing 100083, Peoples R China..
Univ Sci & Technol Beijing, Inst Engn & Technol, Beijing 100083, Peoples R China..
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2021 (English)In: Journal of Materials Research and Technology, ISSN 2238-7854, E-ISSN 2214-0697, Vol. 14, p. 968-984Article in journal (Refereed) Published
Abstract [en]

The flow stress–strain curves appear to be sensitive to deformation conditions. The ratio of critical strain to peak strain εc/εp follows a linear relationship except when the temperature is 1240 °C and the strain rate is 0.001 s−1. During the deformation, the fragmentation and decomposition of γ/α2 lamellae are related to recrystallization of α2 and γ laths in the lamellae and the γ → α2 phase transformation, the former depends on dislocation slip and twinning, and the latter is related to temperature, local stress concentration and diffusion time. As for the recrystallization mechanisms, the γ phase is discontinuous dynamic recrystallization (DDRX) mode, while the α2 phase relies on continuous dynamic recrystallization (CDRX) mode. The β phase has more low-angle grain boundaries (LAGB) during deformation, indicating the continuous coordinated deformation, and this explains the enlarged hot working window of the TiAl alloy (1165–1240 °C/0.001 ~ 1 s−1 and 1120–1165 °C/0.001–0.4 s−1).

Place, publisher, year, edition, pages
Elsevier BV , 2021. Vol. 14, p. 968-984
Keywords [en]
TiAl alloy, Microstructure evolution, Deformation, Hot processing map, Dynamic recrystallization
National Category
Metallurgy and Metallic Materials
Identifiers
URN: urn:nbn:se:kth:diva-303550DOI: 10.1016/j.jmrt.2021.06.107ISI: 000702866400009Scopus ID: 2-s2.0-85110290430OAI: oai:DiVA.org:kth-303550DiVA, id: diva2:1603875
Note

QC 20211018

Available from: 2021-10-18 Created: 2021-10-18 Last updated: 2024-09-02Bibliographically approved

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Yang, Yonggang

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